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Intel Xeon Phi Processor x200 User Manual

Intel Xeon Phi Processor x200
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Figure E-22. Bolster Plate, Spring
13
4
5678
B
C
D
A
123
4
5678
B
C
D
A
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
0.2 A B
70.3±0.2
64±0.1
10.1 0.1
(1.2) THK
2X 4.05 0.1
1±0.1
2X1 0.1
4.65±0.1
2X 1.5
+0.4
-0.1
A
H37309 1 09
DWG. NO SHT. REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 4
09H37309D
REV
DRAWING NUMBER
SIZE
KNL SPRING
TITLE
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL
DATEAPPROVED BY
-
2/20/14
DATECHECKED BY
02/10/14
DATEDRAWN BY
02/10/14
DATEDESIGNED BY
DIMENSIONS ARE IN MILLIMETERS
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTIONPART NUMBER
ITEM NO
QTY
KNL SPRINGH37309-003TOP
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPR
- 01 TOOING RELEASE 9/5/14
02
1. UPDATING DIMENSIONING SCHEME.
2. ADDED DATUMS A & B.
3. UPDATED NOTE 2 TO ADD PROFILE TOLERANCE.
12/08/14
03 1. CHANGED CTF DIMENSION FROM 0.1MM TO 0.3MM 1/7/15
04
1. ADDED NOTE 7 TO ALLOW THE SUPPLIER TO MODIFY THE
LOAD SPRING CENTER HEIGHT DIMENSION AT THEIR
DRISCRESION TO MEET LOAD REQUIREMENTS.
2. REMOVED CTF DIMENSION ON LOAD SPRING HEIGHT
DIMENSION AND MADE IT A REFERENCE DIMENSION.
3. CHANGED THE LOCATION OF DATUM A
2/4/15
8-C
4-A
05
1. CHANGED SPRING WIDTH FROM 10.75MM TO 10.1MM.
2. ROLLED THE PART NUMBER FROM A -001 TO A -002.
3. CHANGED SPRING ARM HEIGHT FROM 0.3MM TO 1MM
4. UPDATED NOTES.
4/8/15
06
1. UPDATED NOTE 3 TO REMOVE REFERENCE TO 3/4 OR FULL
HARD MATERIAL.
2. REMOVED SEVERAL ANGLED DIMENSIONS.
4/16/15
07
1. ADDED NOTE 6 AND 7.
2. IN NOTE 3 CHANGED THE INCREASED YIELD STRENGTH
FROM 900MPa-1100MPa TO 900MPa-1275MPa
3. ROLLED PART NUMBER TO -003, DUE TO RIVET HOLE DIMENSION
CHANGED FROM 4.4MM TO 4.05MM AND ACCESS HOLE LOCATIONS.
4/23/15
8-C
5-C
2-B
08
1. ADDED DIMENSION AND TOLERANCE.
2. UPDATED NOTE CALLOUT FOR STUD DWG FROM H77925 TO H78186.
3. CHANGED NOTE 3 TO INCREASE SPRING THICKNESS TOLERANCE
FROM .035 TO .05
4. CHANGE NOTE 3 YIELD STRENGTH TO MINIMUM 965MPa
5. REMOVE HEAT TREAT COMMENT ON NOTE 4.
8/28/15
C4
A4
09 1. REMOVED TWO CTF DIMENSIONS. 7/11/16
NOTES: UNLESS OTHERWISE SPECIFIED
1. REFERENCE DOCUMENTS:
ASME Y14.5-2009 - STANDARD DIMENSIONS AND TOLERANCES.
UL1439 SHARP EDGE TESTING
A29419 INTEL STANDARD FOR SHEETMETAL
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED
TOLERANCE SHALL BE CONTROLLED BY 3D CAD MODEL DATABASE.
FOR FEATURES NOT EXPLICITLY TOLERANCED:
(BASIC DIMENSIONS FROM THE 3D CAD MODEL)
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT SPECIFICATION (BS-MTN-0001).
A) TYPE SUS301, 1.2MM
.05 THK.
B) CRITICAL MECHANICAL PROPERTIES:
YIELD STRENGTH MINIMUM 965 MPa
C) PLATING: NONE.
4. BURR HEIGHTS SHALL NOT EXCEED 0.15MM.
5. SHARP CORNERS MUST BE CHAMFERED OR ROUNDED TO 0.25MM RADIUS MAX.
6. DIMENSIONS MARKED ARE CRITICAL TO FUNCTION DIMENSIONS (CTF).
7 SEE BOLSTER PLATE ASSEMBLY DRAWING H77470 FOR FIT REQUIREMENTS.
8. OPTIONAL STRESS RELIEF ALLOWED IF MINIMUM LOAD REQUIREMENT IS NOT
MET. SEE LOAD TEST PROCEDURE, DOCUMENT # H95020. LOAD VALUE WILL NEED
TO BE CHECKED FOR EVERY NEW MATERIAL LOT.
B
2 SURFACES
2X 4.5 0.05
PLACEMENT DETERMINED BY
ASSEMBLY DRAWING H77470
7 DETERMINED BY STUD DRAWING H78186 AND
SPRING ASSEMBLY DRAWING H37308
2X DETERMINED BY RIVET DRAWING
H19325 AND ASSEMBLY DRAWING 7
C
C
C
C
C
Retention Assembly Mechanical Drawings
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002
94

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Intel Xeon Phi Processor x200 Specifications

General IconGeneral
BrandIntel
ModelXeon Phi Processor x200
CategoryComputer Hardware
LanguageEnglish

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