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Intel Xeon Phi Processor x200 User Manual

Intel Xeon Phi Processor x200
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Figure E-27. Socket-P, Dust Cover, 1/2
A
A
13
4
5678
B
C
D
A
123
4
5678
B
C
D
A
B
C
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
0.2 A B C
0.4
3X 78
78
58.4
50
73
4
4X 5.5
2X R14.5
2X 95
2X 68
4X 7.4 0.1
A
H77975 1 08
DWG. NO SHT. REV
SHEET 1 OF 2
DO NOT SCALE DRAWING
SCALE: 3
08H77975D
REV
DRAWING NUMBER
SIZE
LGA3647 NRW DUST-COVER
TITLE
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL
DATEAPPROVED BY
-
2/14/17
DATECHECKED BY
2/14/17
DATEDRAWN BY
2/14/17
DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MM
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTIONPART NUMBER
ITEM NO
QTY
LGA3647 NRW DUST-COVERH77975-005TOP
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPR
- 01 TOOLING RELEASE 04/07/15
02 ADDED NOTE 6 TO CALL-OUT CRITICAL TO FUNCTION DIMENSIONS. 4/23/15
PG1 B6
PG1 A6
PG2 A1
03
1. REMOVED PIN 1 MARKING ON 3D CAD MODEL, RESULTING IN
ROLLING THE DASH NUMBER FROM H77975-001 TO H77975-002.
2. CHANGED TRUE POSITION (TP) FROM 0.1 TO 0.25.
3. CHANGED TRUE POSITION (TP) FROM 0.1 TO 0.30.
10/20/15
PG2 B2
PG2 A7
PG1 B3
PG1 C5
04
1. ADDED STIFFENER PROTRUSION IN THE FOUR CORNER HOLES.
2. CHANGED FOUR CORNER HOLES TO OVAL SHAPE.
3. INCREASED LATCH FOOT THICKNESS.
4. CHANGED DATUM B LOCATION
5. ADDED DATUM C
6. ROLLING THE DASH NUMBER FROM H77975-002 TO H77975-003.
4/12/16
PG2 A7 05
1. INCREASED RIB STIFFENER PROTRUSION BY 0.5MM.
DIMENSION FROM RIB TO INSIDE LATCH CHANGED FROM 7.9MM
TO 7.4MM CHANGED AND TESTED FOR KNL CORNER STANDOFFS.
2. DASH PART NUMBER ROLLED FROM H77975-003 TO H77975-004.
5/11/16
PG1 A4 06
1. RIB STIFFENER PROTRUSION UPDATED FOR SKYLAKE CORNER
STANDOFFS.
2. DECREASED OVAL OPENING FROM 7.6MM TO 7.4MM.
3. DASH PART NUMBER ROLLED FROM H77975-004 TO H77975-005.
5/25/16
PG1 C5
PG2 A5
07
1. REMOVED CTF DIMENSION.
2. REMOVED TWO CTF DIMENSIONS.
7/11/16
PG1 A4
PG2 B3
08 1. CHANGED FLATNESS FROM 0.1MM TO 0.4MM 2/14/17
NOTES: UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS:
ASME Y14.5M-2009 - STANDARD DIMENSION AND TOLERANCES
99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS
(WEBSITE - https://supplier.intel.com/static/EHS/)
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT
SPECIFIED TOLERANCE SHALL BE CONTROLLED BY 3D CAD DATABASE
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT
SPECIFICATION (BS-MTN-0001).
A) PC-ABS (V0 FLAME RATING AND MUST PASS 100
C BAKE TEST)
B) COLOR: BLACK
4. FINISH: UNSPECIFIED SURFACES MUST CONFORM WITH CLASS C
REQUIREMENTS.
PART SHALL BE FREE OF OIL AND DEBRIS.
DEBURR ALL SHARP EDGES.
5 USE "LGA Socket/ILM/Backplate Marking Guideline"
INTEL DOCUMENT NUMBER G14577 TO MARK PART IN AREA SHOWN.
6. DIMENSIONS MARKED ARE CRITICAL TO FUNCTION DIMENSIONS (CTF).
SECTION A-A
SCALE 1.5
5
C
C
C
Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
99
Retention Assembly Mechanical Drawings

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Intel Xeon Phi Processor x200 Specifications

General IconGeneral
BrandIntel
ModelXeon Phi Processor x200
CategoryComputer Hardware
LanguageEnglish

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