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Intel Xeon Phi Processor x200 User Manual

Intel Xeon Phi Processor x200
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Figure E-11. Backplate
13
4
5678
B
C
D
A
123
4
5678
B
C
D
A
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
B
0.1 A
.4 A B
108.6
81.6
THICK2.2 0.05
44
2X 26
2X 32
2X 44
2X 70
26.5
19.9
A
G93719 1 07
DWG. NO SHT. REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 2:1
07G93719D
REV
DRAWING NUMBER
SIZE
KNL BACK PLATE
TITLE
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL
-
DATEAPPROVED BY
09/15/15
DATECHECKED BY
08/14/13
DATEDRAWN BY
08/14/13
DATEDESIGNED BY
DIMENSIONS ARE IN MILLIMETERS
THIRD ANGLE PROJECTION
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPR
- 01 TOOLING RELEASE 08/20/14
02
CHANGED OUTER PERIMETER , CENTER AND FOUR SQUARE
OPENING DIMENSIONS. NEW -002 PART NUMBER.
09/12/14
B5
C2
03
1. REMOVED UNNECESSARY DIMENSIONS.
2. UPDATED NOTE 2.
12/11/14
04
1. REMOVED DIMENSIONS.
2. UPDATED NOTE 2 AND NOTE 4
4/27/15
C7 05
1. FIXED DIMENSION WITNESS LINES
2. REMOVED CTF CALLOUT ON 81.6 AND 108.6 BASIC DIMENSION
9/15/15
C1
A7
B4
06
1. CHANGED PROFILE TOLERANCE IN NOTE 2 FROM 0.2 TO 0.4
2. REMOVED FLATNESS CALLOUT.
3. ADDED NOTE 9 TO STATE FLATNESS IS CALLED OUT ON
THE BACKPLATE ASSEMBLY DRAWING H77469.
10/29/15
D7
A7
07
1. ADDED TWO CTF DIMENSIONS
2. REMOVED THICKNESS CTF DIMENSION
7/11/16
NOTES; UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-2009 - STANDARD DIMENSION AND TOLERANCES
UL1439 - UL SHARP EDGE TESTING
164997 - INTEL MARKING STANDARD
A29419 - INTEL TOLERANCE STANDARD FOR SHEETMETAL
C25432 - INTEL COSMETIC SPEC FOR SHEETMETAL
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY
3D CAD DATABASE. FOR FEATURES NOT EXPLICITLY TOLERANCED.
(BASIC DIMENSION FROM 3D CAD MODEL):
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
A) TYPE:SHEET STEEL, SK7, 1065, S50C, OR CHSP60PC-
2.2MM+/-0.05 THK
B) CRITICAL MECHANICAL PROPERTIES:
HEAT TREATED TO 250 MPa MINIMUM YIELD
TENSILE YIELD STRENGTH (ASTM D638) >= 250 MPa
ULTIMATE TENSILE STRENGTH (ASTM D638) >= 300 MPa
C) -PLATING: 2 MICROMETER MIN ELECTROLYTIC NICKEL PLATING
-PROCESS TEST: 168 HRS 85
C / 85% HUMIDITY WITH NO
VISIBLE CORROSION
4 DIMENSIONS MARKED ARE CRITICAL TO FUNCTION DIMENSIONS
(CTF).
5 FINAL DIAMETER, LOCATION AND ORIENTATION OF PRESS FIT STUD
IN ASSY DRAWING H77469 MUST BE MET AND TAKES PRECEDENCE OVER
THIS DRAWING
6. PART SHALL BE FREE OF OIL AND DEBRIS.
7. BURR HEIGHTS SHALL NOT EXCEED 0.1 MM.
8. SHARP CORNERS MUST BE CHAMFERED, OR ROUNDED TO 0.25MM MAX.
9. FLATNESS TO BE CONTROLLED ON THE BACKPLATE ASSEMBLY
DRAWING H77469.
TOP SIDE (INSULATOR SIDE)
BOTTOM SIDE
7X HOLE DRIVEN
PRESS FIT STUD PER ASSEMBLY
DRAWING H77469 5
C
C
C
PARTS LIST
DESCRIPTIONPART NUMBER
ITEM NO
QTY
KNL BACK PLATEG93719-002TOP
Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
83
Retention Assembly Mechanical Drawings

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Intel Xeon Phi Processor x200 Specifications

General IconGeneral
BrandIntel
ModelXeon Phi Processor x200
CategoryComputer Hardware
LanguageEnglish

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