ENGLISH
5
4) Use the heater like the previous case,
advancing slowly from one extreme to another
of the pins line.
(*) Alloy 62 Sn/ 36 Pb/ 2 Ag Type RMA/CMA.
For desoldering
Temperature from 400 to 450°C, an air flowrate
from 7 to maximum, depending on the size of the
component.
Depending on the size of the integrated circuit to
be desoldered, you will have to use:
A) Protector + trípod.
B) Extractor.
C) Trípod.
A) Protector + tripod:
- Select protector and tripod size in function of
the IC to be desoldered and place it over the
component.
- Use the VACUUM button to start the suction
pump and then fit the tripod. Press the sucker
down until it sticks onto the component.
- Use the pedal or the HEAT button to start the
hot-air generator, directing it with a circular
movement at the component terminals and
taking care to distribute the heat evenly.
- When the soldering flux turns liquid the extractor
will automatically lift the component.