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(No.MB362)1-33

3.4.7 Removing the heat sink

(See Figs.11 and 12)

• Prior to performing the following procedures, remove the am-

plifier assembly, rear panel, heat sink BKT, mother board and

amp. board.

(1) Remove the four screws K attaching the power IC to the

heat sink. (See Fig.11)

(2) From the reverse side of the amp. board, remove the three

screws M attaching the heat sink to the amp. board. (See

Fig.12)

(3) Take out the heat sink.

3.4.8 Removing the power IC

(See Fig. 12)

• Prior to performing the following procedures, remove the am-

plifier assembly, rear panel, heat sink BKT, mother board,

amp. board and heat sink.

(1) From the reverse side of the amp. board, remove the sol-

ders from the solder points a on the amp. board.

(2) Take out the power IC.

Fig.11

Fig.12

3.4.9 Removing the LED board

(See Fig.13)

• Prior to performing the following procedures, remove the am-

plifier assembly and rear panel.

(1) From the front side of the amplifier assembly, cut off the tie

bands.

(2) Remove the two screws N attaching the LED board.

(3) From the reverse side of the LED board, remove the solder

from the solder point b on the LED board.

Fig.13

Amp. board

Power ICHeat sink

Amp. board Solder points a

Tie bands

LED board

Solder point b

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