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Installation of semiconductors
The installation surfaces must be clean, even very small particles (0,050mm) between the surfaces
increase the gap between heat sink and module, causing module overheating and possibly
destruction. Heat transfer paste is spread as an even layer about 0,1 mm thick, onto the modules
base plate. The module is immediately attached to the heat sink, in order to avoid any dirt to get
between the components. At first all M5 screws are tightened carefully to torque of 0,5…2 Nm, after
which the module can be tightened to the nominal torque of 3 Nm. After a few minutes the screw
torques are checked again to be 3 Nm.
IGBT mounting onto the heat sink
Secondary unit
As described above but screws are torx T-10 and tightening torque 1,2 Nm. Diodes and discrete
IGBTs can be tighten right away to this torque.
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