TM840 Service Manual
227 2LW1-20UC-270G R Chip Wire-wound Inductance 1 L16
228 2LH1-R903R0-L02-03 R Chip Air Core Inductance 3 L68，L69，L70
229 2LW1-20UC-331J Chip Wire-wound Inductance 2 L4001，L24
230 2LW1-25UC-332K Chip Wire-wound Inductance 1 L4005
231 2LH1-R903R0-L11-05 R Chip Air Core Inductance 1 L67
232 2LG1-SWPA5040S-330M Chip Power Inductor 4 FB15，FB16，FB17，FB18
233 2LG1-SWPA8040-6R8M Chip Power Inductor 1 L1
234 2LG1-SWPA4020-2R2S Chip Power Inductor 2 L2，L4
235 2LW1-20UC-102J Chip Wire-wound Inductance 2 L73，L51
236 2LW1-20UC-8R2M Ceramic Wire-wound Inductance 1 L105
237 2LL1-16-R56JT Stacked Inductor 2 L214，L8
238 2LW1-16UC-220J R Chip Wire-wound Inductance 1 R201
239 2LW1-16UC-120G Chip Wire-wound Inductance 1 L15
240 2LL1-16-1R0K R Stacked Inductor 1 FB34
241 2LG1-SWPA4020S-100M Chip Power Inductor 1 L3
242 2LW1-25UC-471J R Chip Wire-wound Inductance 1 L10
243 2LW1-32UC-150M High-frequency Wire-wound Inductance 2 L124，L137
248 1MR3-MAX-6Q
U-BLOX GPS module,AP570，DM580，STP，STM，
STR
1 U9
249 2CC1-16-Y5V160-334Z Chip Multilayer Capacitor 2 C609，C611
250 2CC1-33-X5R160-476M Chip Capacitance 1 C5
251 2CC1-10-X7R160-104K R Chip Multilayer Capacitor 10 C140，C148，C231， C266，C271，C275，C145，C146，C150，C151
252 2LW1-20UC-100J Ceramic Wire-wound Inductance 1 L114
253 2RS1-16-273J R Chip Resistance 1 R72
254 2RS1-16-820J Chip Resistance 1 R324
255 2CC1-16-C0G500-3R5B Chip Multilayer Capacitor 1 C254
256 2LH1-R903R0-L03-03 R Chip Air Core Inductance 1 L71
257 2RS1-20-220J R Chip Resistance 1 R346
258 2RE1-16-5102 R Chip Precision Resistance 2 R412，R392
259 2RE1-16-2700 Chip Precision Resistance 1 R391
260 2CC1-10-X7R500-102K R Chip Multilayer Capacitor 1 C452
261 2RS1-16-202J R Chip Resistance 1 R28
262 2RS1-10-392J R Chip Resistance 1 R388
263 2RS1-10-222J R Chip Resistance 1 R177
264 2RS1-10-683J R Chip Resistance 1 R140
265 1IP1-000STM-R01 STM-U Burning Chip 1
266 1IM1-NANDS34ML01G1 Chip storage IC 1 U6
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