Lenovo ThinkServer TS150 User Manual

Ethernet connectivity There is one RJ-45 Ethernet connector on the rear panel with 10 megabits per
second (Mbps), 100 Mbps, or 1000 Mbps network connectivity. For more
information, see “Rear view of the server” on page 12.
Security features
• Administrator password and user password to help protect unauthorized access
to the server (see “Using passwords” on page 28)
• ThinkServer Trusted Platform Module (TPM), which is an integrated security chip,
to help enhance server security
• Remote monitoring or control by an administrator to provide protection or help
• Intrusion switch that informs you through an event in the system event log (SEL)
when the server cover is not properly installed or closed
Basic system management
features
• Ability to store the power-on self-test (POST) hardware test results
• BIOS Setup Utility program
The BIOS Setup Utility program helps you view the server information and
configure the server in the pre-operating system environment. See “Using the
Setup Utility program” on page 25.
• Preboot Execution Environment (PXE)
The Intel PXE technology enables you to boot your computers, load an operating
system, or deploy executable images from a remote server by using a network
interface. The operation can be done independently of local data storage devices
(such as hard disk drives) or operating systems.
• Redundant Array of Independent Disks (RAID)
Your server supports onboard SATA software RAID. If a required RAID card is
installed, your server also supports advanced SATA/SAS hardware RAID
configurations. For detailed information, see “Configuring RAID” on page 33.
• Software programs
For more information about the software programs, see “Software programs” on
page 9.
Operating environment
The following table provides information about the operating environment for your server.
Table 1. Operating environment specifications
Air temperature (operating) from 10°C to 35°C (50°F to 95°F)
Air temperature (storage) from -40°C to 60°C (-40°F to 140°F) in original shipping package
Humidity (operating) from 8% to 80% (non-condensing)
Humidity (storage) from 10% to 90% (non-condensing)
Altitude from 0 to 3048 m (0 to 10 000 ft) in an unpressurized environment
Note: When the altitude exceeds 3000 m (10 000 ft), the defined maximum dry-
bulb temperature for operation becomes a dependent variable. The temperature
value decreases by 1°C (1.8°F) per 300 m (984 ft) as the altitude increases.
Software programs
This topic provides information about the software programs that you can use to set up, use, and maintain
the server.
Chapter 3. Product overview 9

Lenovo ThinkServer TS150 Specifications

General

Bus type	DMI3
Scalability	1S
Processor cache	8 MB
Processor cores	4
Processor model	E3-1225V5
System bus rate	8 GT/s
Processor series	Intel Xeon E3-1200 v5
Processor socket	LGA 1151 (Socket H4)
Processor codename	Skylake
Execute Disable Bit	Yes
Processor frequency	3.3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor boost frequency	3.7 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 1x8+2x4, 2x8
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)	80 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor	1.35 V
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600, 1866, 2133 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	64 GB
HDD size	3.5 \
RAID levels	0, 1, 5, 10
HDD interface	Serial ATA
Optical drive type	DVD-ROM
Total storage capacity	2000 GB
Maximum storage capacity	24 TB
Number of HDDs installed	2
Internal memory	8 GB
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Memory layout (slots x size)	1 x 8 GB
On-board graphics card ID	0x191D
On-board graphics card model	Intel® HD Graphics P530
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.7 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	400 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1150 MHz
Number of displays supported (on-board graphics)	3
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
USB 2.0 ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	8
PCI Express slots version	3.0
Operating altitude	0 - 3048 m
Storage temperature (T-T)	-40 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	10 - 90 %
Operating relative humidity (H-H)	8 - 80 %
Power supply	400 W
Power supply input frequency	50 - 60 Hz
Redundant power supply (RPS) support	-
Chassis type	Tower
Operating system installed	Windows Server 2012 Foundation
Compatible operating systems	Windows Server 2012/2012 R2, Red Hat Enterprise Linux, SUSE Linux 11/12, Windows 10, Canonical Ubuntu 14.04, VMware vSphere 2015
Processor ARK ID	88168
Intel Secure Key Technology version	1.00
Intel® Hyper Threading Technology (Intel® HT Technology)	No

Weight and Dimensions

Depth	431 mm
Width	175 mm
Height	375 mm
Weight	12500 g