Lenovo ThinkSystem SR665 V3 - Technical Specifications

Refer to the below table for specifications categories and the content of each category.
Specification
category
Technical specifications Mechanical specifications Environmental specifications
Content
• Processor
• Memory
• Internal drives
• Expansion slots
• Storage controller
• Integrated functions and I/O
connectors
• Network
• System fan
• Power supplies
• Minimal configuration for
debugging
• Operating systems
• Dimension
• Weight
• Acoustical noise emissions
• Environment
• Particulate contamination
Technical specifications
Summary of the technical specifications of server. Depending on the model, some features might not be
available, or some specifications might not apply. The latest specifications information is always available at
https://lenovopress.lenovo.com/.
Processor
Supports fourth-generation AMD
®
EPYC
TM
processors, with 5nm process technology.
• Up to two processors with the new LGA 6096 (SP5) socket
• Up to 96 Zen4 cores (192 threads) per socket
• Up to 4 xGMI3 links at up to 32 GT/s
• Thermal Design Power (TDP): up to 400 watts
For a list of supported processors, see
https://serverproven.lenovo.com/.
Memory
See “Memory module installation rules and order” in User Guide or Hardware Maintenance Guide for detailed
information about memory configuration and setup.
• Slots: 24 dual inline memory module (DIMM) slots (12 channels per processor, 1 DIMM per channel)
• Memory module type: TruDDR5 RDIMM 16 GB (1Rx8), 32 GB (2Rx8), 64 GB (2Rx4 10x4)
• Capacity:
– Minimum: 16 GB (1 x 16 GB RDIMM)
– Maximum: 1.5 TB (24 x 64 GB RDIMM)
• Speed: 4800 MT/s
For a list of supported memory modules, see
https://serverproven.lenovo.com/.
Internal drives
• Front drive bays:
– Up to 24 x 2.5-inch hot-swap SAS/SATA/NVMe drives
– Up to 12 x 3.5-inch hot-swap SAS/SATA drives
• Rear drive bays:
– Up to 4 x 2.5-inch hot-swap SAS/SATA drives
• Up to two internal M.2 drives
Chapter 1. Introduction 3