3300pF
50V
C246
30K
1%
R209
3300pF
50V
C219
NR8040T3R6N
3.6uH
L210
THERMAL
TPS54327DDAR
IC206
3
VREG5
2
VFB
4
SS
1
EN
5
GND
6
SW
7
VBST
8
VIN
9
[EP]GND
+3.3V_THCV
MLB-201209-0120P-N2
L207
10K
R231
0
R223
22K
1%
R210
0
R211
30K
1%
R212
68K
1%
R220
+3.3V
22pF
50V
OPT
C244
+1.8V_THCV
22uF
10V
C236
100pF
50V
OPT
C213
5.6K
1%
R224
+1.5V_LG1122
0.1uF
16V
C227
22K
1%
R228
0.1uF
16V
C250
NR8040T3R6N
3.6uH
L209
+12V_BE
THERMAL
TPS54327DDAR
IC205
3
VREG5
2
VFB
4
SS
1
EN
5
GND
6
SW
7
VBST
8
VIN
9
[EP]GND
+12V_BE
10K
R215
MLB-201209-0120P-N2
L212
22uF
10V
C262
+0.95V_LG1122
18K
1%
R206
THERMAL
TPS54327DDAR
IC201
3
VREG5
2
VFB
4
SS
1
EN
5
GND
6
SW
7
VBST
8
VIN
9
[EP]GND
+1.5V_LG1122
NR8040T3R6N
3.6uH
L211
0.1uF
16V
C252
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
22pF
50V
OPT
C240
0.1uF
16V
C251
22uF
10V
C266
+3.3V
+3.3V
10K
R230
10K
R229
0.1uF
16V
C224
22K
1%
R207
0.1uF
16V
C222
THERMAL
TPS54327DDAR
IC202
3
VREG5
2
VFB
4
SS
1
EN
5
GND
6
SW
7
VBST
8
VIN
9
[EP]GND
+3.3V_THCV
MLB-201209-0120P-N2
L213
+3.3V
+1.8V_LG1122
22uF
10V
C260
+1.8V_LG1122
THERMAL
TPS54327DDAR
IC204
3
VREG5
2
VFB
4
SS
1
EN
5
GND
6
SW
7
VBST
8
VIN
9
[EP]GND
22uF
10V
C239
3300pF
50V
C220
22uF
10V
C264
0.1uF
16V
C226
22uF
10V
C265
5.1K
1%
R227
NR8040T3R6N
3.6uH
L204
0.1uF
16V
C249
22uF
10V
C263
3300pF
50V
C221
22uF
10V
C237
THERMAL
TPS54327DDAR
IC203
3
VREG5
2
VFB
4
SS
1
EN
5
GND
6
SW
7
VBST
8
VIN
9
[EP]GND
0.01uF
50V
C248
22pF
50V
OPT
C242
3.6K
1%
R205
22K
1%
R225
22pF
50V
OPT
C215
10K
R216
0
R208
22uF
10V
C232
MLB-201209-0120P-N2
L206
MLB-201209-0120P-N2
L214
22uF
10V
C238
+2.5V_PA138
0.1uF
16V
C223
22K
1%
R213
NR8040T3R6N
3.6uH
L205
+12V_BE
0.1uF
16V
C253
22pF
OPT
C217
22K
1%
R222
MLB-201209-0120P-N2
L208
+0.95V_LG1122
10K
R214
0.1uF
16V
C225
+2.5V_PA138
22uF
10V
C234
+12V_BE
+12V_BE
+12V_BE
+1.8V_THCV
5.1K
1%
R221
3300pF
50V
C247
NR8040T3R6N
3.6uH
L203
68K
1%
R226
0
R217
0
R218
0
R234
0
R232
0
R233
0
R219
51K
1%
R202
+3.3V
0.1uF
16V
C202
0.1uF
16V
OPT
C203
22K
1%
R203
+2.7V_FPGA
THERMAL
TJ4220GDP-ADJ
IC200
3
VIN3
2
EN2
4
NC4
1
NC_1
5
NC_2
6
VOUT
7
ADJ/SENSE
8
GND
9
[EP]GND
0.1uF
16V
C212
0.01uF
50V
C206
0
R204
0
R200
1K
1%
R201
10uF
25V
C228
10uF
25V
OPT
C231
10uF
25V
OPT
C235
10uF
25V
C256
10uF
25V
C257
0.1uF
16V
C254
10uF
25V
OPT
C261
10uF
25V
OPT
C258
10uF
25V
C255
10uF
25V
OPT
C259
10uF
25V
C230
10uF
25V
C201
10uF
25V
OPT
C210
10uF
25V
C209
10uF
25V
OPT
C233
10uF
25V
C229
1uF
10V
C216
1uF
10V
C214
1uF
C218
1uF
10V
C241
1uF
10V
C243
1uF
10V
C245
Vout=0.765*(1+R1/R2)
Vout=0.765*(1+R1/R2)
tss(ms)=[C304(nF)*Vref]/Iss(uA)
2 21
MAX 0.078A
MAX 0.345A
MAX 2.24A
Vout=0.765*(1+R1/R2)
Vout=0.765*(1+R1/R2)
THCV for 1.8V
MAX 0.38A
tss(ms)=[C303(nF)*Vref]/Iss(uA)
R2
FRC-III DDR3 for 1.5V
R1
THCV for 3.3V
R2
tss(ms)=[C304(nF)*Vref]/Iss(uA)
R2
MAX 1.97A
Vout=0.765*(1+R1/R2)
R2
tss(ms)=[C321(nF)*Vref]/Iss(uA)
R2
R1
FRC-III CORE for 0.95V
R1
R1
R2
FRC-III I/O for 3.3V
tss(ms)=[C303(nF)*Vref]/Iss(uA)
R1
tss(ms)=[C321(nF)*Vref]/Iss(uA)
MAX 2.962A
Vout=0.765*(1+R1/R2)
R1
FRC-III AIP for 1.8V
THCV Block
MAX 0.045A
Vout=0.8*(1+R2/R1)
R1
R2
FPGA for 2.7V
2012.06.05EAX64768002
1.0
Copyright ⓒ 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes