7
E3X-HD
Heat-resistant Models
Area Detection Models
* The fiber length is 2 m on each side, so the sensing distance is given as 4,000 mm.
Liquid-level Detection Models
Vacuum-resistant Models
* The fiber length is 1 m on each side, so the sensing distance is given as 2,000 mm.
Models for FPD, Semiconductors, and Solar Cells
* The fiber length is 2 m on each side, so the sensing distance is given as 4,000 mm.
Sensing method Size Model
Sensing distance (mm)
Giga mode Standard mode
High-speed
mode
Super-high-
speed mode
Through-beam
100°C E32-T51R 2M 1,600 800 560 225
150°C E32-T51 2M 2,800 1,500 1,000 400
200°C E32-T81R-S 2M 1,000 550 360 140
350°C E32-T61-S 2M 1,680 900 600 240
Reflective
100°C E32-D51R 2M 670 280 190 80
150°C E32-D51 2M 1,120 450 320 144
200°C E32-D81R-S 2M 420 180 120 54
300°C
E32-A08H2 2M 10 to 20 ---
E32-A09H2 2M 20 to 30 (center 25) ---
350°C
E32-D611-S 2M
420 180 120 54
E32-D61-S 2M
400°C E32-D73-S 2M 280 120 80 36
Sensing method Type Sensing width Model
Sensing distance (mm)
Giga mode Standard mode
High-speed
mode
Super-high-
speed mode
Through-beam Area
11 mm
E32-T16PR 2M 3,100 1,700 1,120 440
E32-T16JR 2M 2,750 1,500 960 380
30 mm E32-T16WR 2M 4,000 * 2,600 1,700 680
Reflective Array 11 mm E32-D36P1 2M 700 300 200 90
Sensing method Tube diameter Feature Model
Sensing distance (mm)
Giga mode Standard mode
High-speed
mode
Super-high-
speed mode
Tube-mounting
3.2, 6.4,
or 9.5 dia.
Stable residual
quantity detection
E32-A01 5M
Applicable tube: Transparent tube with a diameter of 3.2, 6.4, or 9.5 mm,
Recommended wall thickness: 1 mm
8 to 10 dia.
Mounting at
multiple levels
E32-L25T 2M
Applicable tube: Transparent tube with a diameter of 8 to 10 mm,
Recommended wall thickness: 1 mm
No restrictions Large tubes E32-D36T 5M Applicable tube: Transparent tube (no restrictions on diameter)
Liquid contact (heat-resistant
up to 200
°
C)
--- --- E32-D82F1 4M Liquid-contact type
Sensing method Heat-resistant temperature Model
Sensing distance (mm)
Giga mode Standard mode
High-speed
mode
Super-high-
speed mode
Through-beam
120°C
E32-T51V 1M 720 400 260 100
E32-T51V 1M+E39-F1V 2,000 * 2,000 * 1,360 520
200°C E32-T84SV 1M 1,760 950 640 260
Sensing method Application
Operating
temperature
Model
Sensing distance (mm)
Giga mode Standard mode
High-speed
mode
Super-high-
speed mode
Limited-reflective
Glass presence detection
70°C
E32-L16-N 2M
0 to 15 0 to 12
Glass substrate alignment
E32-A08 2M
10 to 20 ---
300°C
E32-A08H2 3M
70°C
E32-A12 2M
12 to 30 ---
Glass substrate mapping
E32-A09 2M
15 to 38 ---
300°C
E32-A09H2 2M
20 to 30 (center 25) ---
Wet processes: Cleaning, Resist
developing and etching
60°C
E32-L11FP 5M
8 to 20 mm from tip of lens (Recommended sensing distance: 11 mm),
19 to 31 mm from center of mounting hole A (Recommended sensing distance: 22 mm)
Wet process:
Resist stripping
85°C
E32-L11FS 5M
8 to 20 mm from tip of lens (Recommended sensing distance: 11 mm),
32 to 44 mm from center of mounting hole A (Recommended sensing distance: 35 mm)
Through-beam Wafer mapping 70°C
E32-A03 2M
3,220 1,780 1,200 500
E32-A03-1 2M
E32-A04 2M
1,280 680 450 200
E32-T24SR 2M
4,000 * 2,200 1,460 580
E32-T24S 2M
4,000 * 2,600 1,740 700
Erstellt am 28.09.2020 um 20:20 Uhr | Alle Angaben ohne Gewähr, Irrtümer und Änderungen vorbehalten! Seite 8 von 14
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