Some chassis components may have sharp edges.
Be careful when disassembling and servicing.
17 Disassembly and Main Component Replacement
Procedures
“ATTENTION SERVICER”
1. This section describes procedures for checking the operation of the major printed circuit boards and replacing the main
components.
2. For reassembly after operation checks or replacement, reverse the respective procedures.
Special reassembly procedures are described only when required.
3. Select items from the following index when checks or replacement are required.
Warning:
This product uses a laser diode. Refer to caution statement Precaution of Laser Diode.
17.1. Disassembly flow chart
The following chart is the procedure for disassembling the casing and inside parts for internal inspection when carrying out the
servicing
To assemble the unit, reverse the steps shown in the chart below.
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SA-HT530GCP
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