PDR X410 - Page 22

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Control and Settings (continued)
Power/Time/Temp Settings (For reference only - already preset in the default profiles)
TopHeat Power Settings (Max%)
Attachment \ Zone
Preheat 1
Preheat2
Soak
Reflow
Dwell
Cool
F150
0 - 10
20 - 30
20 - 30
55 - 65
30 - 40
0
F200
0 - 10
25 - 35
25 - 35
60 - 70
35 - 45
0
F400
0 - 15
35 - 45
35 - 45
65 - 75
45 - 55
0
F700
0 - 20
45 - 55
45 - 55
75 - 85
55 - 65
0
Auto Mode
0
100
100
100
60-100
0-30
Backheater Power Settings (%)
Rating
Preheat 1
Preheat2
Soak
Reflow
Dwell
Cool
750W
50 - 80
50 - 80
50 - 80
50 - 80
25-40
0
1600/2000W
60 - 100
60 - 100
60 - 100
60 - 100
35-50
0
3000W
60 - 100
60 - 100
60 - 100
60 - 100
35-50
0
Typical Time Settings (Seconds)
Attachment \ Zone
Preheat 1
Preheat2
Soak
Reflow
Dwell
Cool
F150
40
40
30-40
30
15
30
F200
60
40
30-40
30
15
30
F400
90
45
30-40
40
15
30
F700
90-120+
45-60
30-40
40-60
15-30
30-60
Typical Temperature Target Settings (°C)
Zone
Preheat 1
Preheat2
Soak
Reflow
Dwell
Cool
Component (T/C1)
100
150
150
220-230
220-230
150
Lead-free (T/C1)
100
170
170
240-250
240-250
150
The tables only provide general guidelines as many factors influence the required settings (i.e. position of a
component/thermal mass of PCB) therefore the same component on a different board may possess very different
thermal characteristics.
For more precise information on actual temperature reached on a component and/or PCB, the Data Logging feature
in the software provides a graphical report of the temperatures reached during rework cycles.
Summary
The information in this section helps give you a very basic explanation of the system. To use the system see the next
sections of ‘Operating Procedures’.