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Details display type, screen size, tuning systems, colour systems, video playback, presets, and formats.
Provides an overview of the front, side, and rear connection ports with their labels.
Gives an overview of the chassis structure and the location of Printed Wiring Boards (PWBs).
Details safety regulations for repair, including isolation transformer use and component replacement.
Warns about high voltage flashovers and provides picture tube discharge methods.
Explains resistor/capacitor notation, value multipliers, and asterisk usage in schematics.
Covers general rework procedures and device removal for Ball Grid Array components.
Discusses requirements for lead-free solder and how to identify lead-free sets.
Explains how to identify alternative Bill of Materials using serial numbers.
Explains the service connector for software uploading using the IAP tool.
Provides instructions for disassembling the set, including rear cover removal.
Describes service positions for better access to components on LSP and SSB.
Details the process for removing various assemblies and boards like SSB and I/O panels.
Instructions for removing the Large Signal Panel (LSP) from its bracket.
Provides instructions for re-assembling the set after repairs, emphasizing wire placement.
Explains how test points are identified and the limitations of waveform measurements.
Introduces Service Default Mode (SDM) and Service Alignment Mode (SAM).
Details the purpose, specifications, and how to enter the Service Alignment Mode.
Introduces the error code buffer and how errors are logged and maintained.
Describes methods for reading error codes on-screen, via blinking LED, or IAP.
Explains methods to clear the error buffer, including SAM menu commands.
Explains how to activate the blinking LED procedure for reading error codes.
Information on upgrading software via the IAP Tool.
General tips for fault finding, including initial checks and common issues.
Troubleshooting steps for white lines, snowy, and black and white picture issues.
Discusses using the NVM Editor in SAM mode for direct NVM content changes.
Details the SAM menu structure for the L06.1E AA chassis.
Shows the overall wiring connections for the TV set.
Block diagram illustrating power supply and deflection circuits.
Detailed layout of test points on the Large Signal Panel (LSP).
Block diagram for the video processing path.
Block diagram illustrating the audio processing path.
Diagram showing the I2C communication overview between components.
Overview of power supply lines distributed throughout the chassis.
Circuit diagrams for various LSP sections including power, deflection, audio, tuner.
Circuit diagrams for SSB sections: power, microprocessor, tuner, HDMI, deflection controller.
Circuit diagram for the CRT Panel, including bias and mirror circuits.
Circuit diagram for the Front Interface Panel.
PWB layout diagrams for the Large Signal Panel (Top, Bottom, Parts).
PWB layout diagrams for the Small Signal Board (Top and Bottom sides).
PWB layout diagrams for the CRT Panel (Top and Bottom sides).
PWB layout diagrams for the Front Interface Panel (Top and Bottom sides).
General conditions and default settings required for electrical adjustments.
Lists default settings for picture mode, contrast, brightness, etc.
Procedure for adjusting the Vg2 (Screen) voltage for focus.
Procedure for static and dynamic focus adjustment using potentiometers.
Explains how to perform software alignments using the SAM menu.
Procedure for AGC alignment using a colour bar signal.
Adjusting colour temperature (Normal, Delta Cool, Delta Warm) with cursor keys.
Introduction to option settings and their purpose.
Explains how microprocessor uses option codes for IC addressing and diagnosis.
Details option codes in table format at bit level for SAM menu.
Defines options like Philips Tuner, ACI, UK PNP, Virgin Mode, Tilt, Wide Screen.
Introduces the L06.1E TV, its features like 100Hz, Flat screen, Pixel Plus.
General description of the new SSB, its components and functionalities.
Explains software upgrade via IAP tool.
Lists common abbreviations used in the manual with their meanings.
States that this section shows block diagrams and pin layouts for ICs.
Lists specific set models and their associated part numbers.
Lists general parts for the set level, likely common components.
Lists parts specific to the Large Signal Panel (LSP).
Lists parts specific to the Side I/O and Control Board.
Lists parts for the IAP Board.
Lists various miscellaneous parts.
Indicates that this is the initial version of the manual.
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