Safety Instructions, Warnings, and Notes
EN 6 LC4.2E AA2.
Device Replacement
The last step in the repair process is to solder the new
component on the board. Ideally, the (LF)BGA should be
aligned under a microscope or magnifying glass. If this is not
possible, try to align the (LF)BGA with any board markers.
To reflow the solder, apply a temperature profile according to
the IC data sheet. So as not to damage neighbouring
components, it may be necessary to reduce some
temperatures and times.
More Information
For more information on how to handle BGA devices, visit this
URL: http://www.atyourservice.ce.philips.com
(needs
subscription). After login, select “Magazine”, then go to
“Workshop Information”. Here you will find Information on how
to deal with BGA-ICs.
2.3.4 Lead Free Solder
Some PWBs in this chassis are “lead-free prepared”. This is
indicated on the PWB by the PHILIPS lead-free logo (either by
a service-printing or by a sticker). It does not mean that lead-
free solder is actually used!
Figure 2-2 Lead-free logo
2.3.5 Practical Service Precautions
• It makes sense to avoid exposure to electrical shock.
While some sources are expected to have a possible
dangerous impact, others of quite high potential are of
limited current and are sometimes held in less regard.
• Always respect voltages. While some may not be
dangerous in themselves, they can cause unexpected
reactions - reactions that are best avoided. Before reaching
into a powered TV set, it is best to test the high voltage
insulation. It is easy to do, and is a good service precaution.
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