Quectel EC200T Series

LTE Standard Module Series
EC200T Series Hardware Design
EC200T_Series_Hardware_Design 86 / 90
3.85
2.0
2.0
3.0
3.5
0.8
1.5
3.23.43.2
3.4
3.2
6.8
3.45
29.0＋/-0.15
1.90
3.5
1.9
32.0＋/-0.15
3.4
2.8
4.8
0.87
5.96
1.6
2.49
2.4
2.15
4.37
1.7
4.82
1.8
1.8
1.15
1.05
1.30
1.30
1.1
1.1
2.0
3.0
Pin 1
Figure 37: Module Bottom Dimensions (Bottom View)
The package warpage level of the module conforms to JEITA ED-7306 standard.
NOTE