LTE Standard Module Series
EC200T Series Hardware Design
EC200T_Series_Hardware_Design 91 / 90
Table 44: Recommended Thermal Profile Parameters
1. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12
hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly
identifiable and the QR code is still readable, although white rust may be found.
Factor Recommendation
Soak Zone
Max slope 1–3 °C/s
Soak time (between A and B: 150 °C and 200 °C) 70–120 s
Reflow Zone
Max slope 2–3 °C/s
Reflow time (D: over 220°C) 45–70 s
Max temperature 238 °C to 246 °C
Cooling down slope -1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle 1
NOTES
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