LTE Standard Module Series
EC21_Series_Hardware_Design
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1. The module offers the best performance when the internal baseband chip stays below 105 °C.
When the maximum temperature of the BB chip reaches or exceeds 105 °C, the module works
normal but provides reduced performance (such as RF output power, data rate, etc.). When the
maximum BB chip temperature reaches or exceeds 115 °C, the module will disconnect from the
network, and it will recover to network connected state after the maximum temperature falls below
115 °C. Therefore, the thermal design should be maximally optimized to make sure the maximum
BB chip temperature always maintains below 105 °C. Customers can execute AT+QTEMP and get
the maximum BB chip temperature from the first returned value. For details of the command ,see
document [3].
2. For more detailed guidelines on thermal design, see document [8].
NOTE
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