Quectel MC60 - Audio Interface Design; Handset Audio Connections; Hands-free Audio Connections; Earphone Audio Connections

A
MC60
Tiger CHENG
CHECKED BY
DRAWN BY
OF
A
6
5
4
32
1
SHEET
A
B
C
D
123456
D
C
B
Quectel Wireless Solutions
PROJECT
SIZE
TITLE
VER
63 DATE
2016/5/30
Reference Design
A2
Close to handset connector
Hands-free Application of AIN/AOUT2
NOTES
1. AGND is reommended to be routed separately.
2.10p&33p capacitors are used for filtering TDD noise.
Note 2
Close to MIC
Handsets Application of AIN/AOUT1
3. AIN has bias voltage of microphone.
Close to Socket
Close to Socket
Close to Socket
+
Earphone Application of AIN/AOUT2
Note 6
Note 6
6. These components are used to enhance the ESD performance of MIC lines,
and thus it is strongly recommended to reserve them.
Audio Design
Close to Speaker
4. AOUT1 is capable of driving 32ohm load.
5. AOUT2 is capable of driving 8ohm load and Earphone.
Note 1
4
1
3
2
J303
HANDSETCON
C322
33pF
C327
10pF
C328
33pF
C329
10pF
C330
33pF
C314
33pF
C316
33pF
C317
10pF
C315
10pF
C318
33pF
C313
10pF
C321
10pF
J301
MIC
C301
10pF
C302
33pF
C303
10pF
C305
10pF
C304
33pF
C306
33pF
1
2
3
4
J304
Earphone
C323
10pF
C324
33pF
C319
4.7uF
C325
10pF
C326
33pF
R303
0R
D307
ESD9B5.0ST5G
D308
ESD9B5.0ST5G
D309
ESD9B5.0ST5G
C320
22uF
D305
ESD9B5.0ST5G
D306
ESD9B5.0ST5G
D310
ESD9B5.0ST5G
D301
ESD9B5.0ST5G
D302
ESD9B5.0ST5G
1
2
J302
FB301
FBMH1608HM601-T
FB302
FBMH1608HM601-T
C309
10pF
C311
10pF
C307
10pF
C310
33pF
C308
33pF
C312
33pF
R301
0R
R302
0R
D303
ESD9B5.0ST5G
D304
ESD9B5.0ST5G
[1]
SPKN
[1,3]
MICP
AGND
AGND
[1]
SPKP
[1,3]
MICP
[1,3]
MICN
[1,3]
MICP
[1,3]
MICN
[1,3]
LOUDSPKP
[1,3]
MICN
[1]
LOUDSPKN
[1,3]
LOUDSPKP
Quectel
Preliminary