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General| Form Factor | LGA |
|---|---|
| Frequency Bands (LTE FDD) | B1/B2/B3/B4/B5/B7/B8/B12/B13/B18/B19/B20/B25/B26/B28/B66 |
| Frequency Bands (LTE TDD) | B38/B39/B40/B41 |
| Frequency Bands (WCDMA) | B1/B2/B4/B5/B6/B8/B19 |
| Frequency Bands (GSM) | 850/900/1800/1900MHz |
| Data Rate (LTE DL) | 150Mbps |
| Data Rate (LTE UL) | Up to 50 Mbps |
| Data Rate (UMTS DL) | Up to 42 Mbps |
| Data Rate (UMTS UL) | Up to 5.76 Mbps |
| Operating Temperature | -40°C to +85°C |
| Storage Temperature | -45°C to +90°C |
| Dimensions | 29.0mm × 32.0mm × 2.4mm |
| GNSS | GPS/GLONASS/BeiDou/Galileo/QZSS |
| UART Interface Count | 2 |
| RoHS Compliance | Yes |
| Module Type | LTE Module |
| Category | GSM/GPRS Module |
| Interface | USB 2.0, UART, I2C, SPI |
| Power Supply | 3.4V to 4.2V |
| SIM Interface | 1.8V/3V |
| Networking Protocols | TCP/UDP/PPP/FTP/HTTP/HTTPS/SMTP |
| Firmware Update | USB |
| Antenna Interface | Main antenna |
| Certifications | CE, FCC, GCF, PTCRB |
Essential safety precautions for operating the EG25-G module and related devices.
Overview of the EG25-G module, its capabilities, and applications.
Detailed list of the EG25-G module's technical specifications and functionalities.
Block diagram illustrating the EG25-G module's major internal components and their interconnections.
Information about the EG25-G evaluation board for customer development and testing.
Introduction to the EG25-G's 144 LGA pads and the sub-interfaces they support.
Visual representation of the EG25-G module's pin layout and numbering.
Detailed explanation of each pin's function, type, DC characteristics, and comments.
Summary of different operating modes of the EG25-G module, like Normal, Airplane, and Sleep.
Procedures and configurations for reducing the EG25-G module's power consumption during sleep mode.
Details on VBAT pins, voltage domains, and recommendations for power supply design.
Procedures and circuit examples for turning the EG25-G module on and off using PWRKEY or AT commands.
Methods and circuit designs for resetting the EG25-G module using the RESET_N pin.
Pin definitions and reference circuits for connecting a (U)SIM card to the EG25-G module.
Description of the EG25-G's USB 2.0 interface, its uses, and reference circuit design.
Details on the main and debug UART interfaces, including pin definitions and logic levels.
Information on PCM digital interface for audio and I2C interface, including timing and pin definitions.
Specification of the EG25-G's SDIO 3.0 interface for SD card connection and design principles.
Details on SDIO for WLAN and UART/PCM for BT, including pin definitions and reference circuits.
Information on the integrated Ethernet MAC with SGMII interface, features, and reference circuit.
Description of the two analog-to-digital converter (ADC) interfaces and how to read voltage values.
Explanation of NET_MODE and NET_STATUS pins for indicating network connection status.
Description of the STATUS pin, an open drain output for indicating module operation status.
Configuration options and default behavior for the Ring Indicator (RI) pin.
Functionality of the USB_BOOT pin for entering emergency download mode for firmware upgrades.
Overview of the EG25-G's integrated GNSS solution and its supported protocols.
Table detailing GNSS performance metrics like sensitivity, TTFF, and accuracy.
Recommendations for PCB layout related to GNSS antenna placement and trace routing.
Pin definitions, operating frequencies, and reference designs for main and diversity antennas.
Pin definition and frequency specifications for the GNSS antenna.
Requirements for antennas and recommendations for RF connector usage.
Specifies the maximum allowable voltage and current limits for module pins.
Details on module voltage inputs, peak supply current, and USB detection voltage.
Defines the operational and storage temperature ranges for the EG25-G module.
Comprehensive table detailing the EG25-G module's current consumption in various modes and states.
Table showing the maximum and minimum RF output power levels across different frequency bands.
Data on the EG25-G module's conducted RF receiving sensitivity for various bands and modes.
Information on ESD handling precautions and the module's discharge characteristics.
Guidelines for PCB layout and heatsink design to ensure optimal thermal performance.
Drawings and specifications for the physical size and dimensions of the EG25-G module.
Recommended PCB footprint layout for the EG25-G module, including keepout areas.
Visual representations of the EG25-G module's top and bottom views.
Guidelines for storing the EG25-G module, including shelf life and environmental conditions.
Recommendations for stencil thickness, reflow soldering temperature profiles, and manufacturing processes.
Details on the EG25-G module's packaging, including tape and reel specifications.
Information on FCC certification, modular approval, labeling, and RF exposure compliance.
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