Quectel EG25-G User Manual

LTE Module Series
EG25-G Hardware Design
EG25-G_Hardware_Design 18 / 100
6. Keep all RESERVED pins and unused pins unconnected.
7. GND pads 85~112 should be connected to ground in the design. RESERVED pads 73~84 should not
be designed in schematic and PCB decal, and these pins should be served as a keepout area.
8. “*” means under development.
3.3. Pin Description
The following tables show the pin definition of EG25-G modules.
Table 3: I/O Parameters Definition
Type
Description
AI
Analog input
AO
Analog output
DI
Digital input
DO
Digital output
IO
Bidirectional
OD
Open drain
PI
Power input
PO
Power output
Table 4: Pin Description
Power Supply
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
VBAT_BB
59, 60
PI
Power supply for
module’s baseband
part
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be able to
provide sufficient
current up to 0.8A.
VBAT_RF
57, 58
PI
Power supply for
module’s RF part
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be able to
provide sufficient
current up to 1.8A in a
burst transmission.

Quectel EG25-G Specifications

General

Brand	Quectel
Model	EG25-G
Category	GSM/GPRS Modules
Language	English