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Quectel EG25-G User Manual

Quectel EG25-G
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LTE Module Series
EG25-G Hardware Design
EG25-G_Hardware_Design 82 / 100
The heatsink should be designed with as many fins as possible to increase heat dissipation area.
Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and
module/PCB.
The following shows two kinds of heatsink designs for reference and customers can choose one or both
of them according to their application structure.
Heatsink
EG25-G Module
Application Board
Application Board
Heatsink
Thermal Pad
Shielding Cover
Figure 41: Referenced Heatsink Design (Heatsink at the Top of the Module)
Thermal Pad
Heatsink
Application Board
Application Board
Heatsink
Thermal Pad
EG25-G Module
Shielding Cover
Figure 42: Referenced Heatsink Design (Heatsink at the Backside of Customers PCB)

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Quectel EG25-G Specifications

General IconGeneral
BrandQuectel
ModelEG25-G
CategoryGSM/GPRS Modules
LanguageEnglish

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