Quectel EG25-G - Figure 41: Referenced Heatsink Design (Heatsink at the Top of the Module)

LTE Module Series
EG25-G Hardware Design
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 The heatsink should be designed with as many fins as possible to increase heat dissipation area.
Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and
module/PCB.
The following shows two kinds of heatsink designs for reference and customers can choose one or both
of them according to their application structure.
Heatsink
EG25-G Module
Application Board
Application Board
Heatsink
Thermal Pad
Shielding Cover
Figure 41: Referenced Heatsink Design (Heatsink at the Top of the Module)
Thermal Pad
Heatsink
Application Board
Application Board
Heatsink
Thermal Pad
EG25-G Module
Shielding Cover
Figure 42: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)