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General| Manufacturer | Quectel |
|---|---|
| GPRS | Yes |
| GNSS | GPS/GLONASS/BeiDou/Galileo/QZSS |
| Series | SC200E |
| Frequency Bands | LTE: B1/B3/B5/B8/B20/B28/B38/B40/B41 |
| Data Transmission | LTE, GPRS |
| Interface | USB 2.0, UART, SPI, I2C, GPIO, ADC |
Defines special marks used in the document for under-development features or unavailable samples.
Lists the supported frequency bands and network standards for different module variants.
Details the core hardware and software features of the SC200E series modules.
Provides a block diagram illustrating the major functional parts of the module.
Information about the Evaluation Board (EVB) for convenient application development and testing.
Overview of the module's interfaces and functions, including power, I/O, and communication.
Visual representation of the module's pin layout and numbering.
Detailed description of each pin's function, I/O type, and DC characteristics.
Details the power supply requirements, pins, and voltage stability for the module.
Instructions and reference circuits for turning the module on and off using PWRKEY.
Specifications and pin definitions for the USB Type-C interface.
Details the three UART interfaces available for serial communication.
Information on the two (U)SIM interfaces, including voltage support and hot-plug.
Description of the SD card interface, its protocol, and pin definitions.
Overview of the abundant General Purpose Input/Output (GPIO) interfaces.
Details the four I2C interfaces for connecting peripherals and sensors.
Details the Liquid Crystal Module (LCM) interface, compliant with MIPI DSI.
Specifications for connecting cameras using MIPI CSI standard.
Guidelines for designing MIPI interfaces for optimal performance and signal integrity.
Details the analog input and output channels for audio functionalities.
Interface for forcing the module into emergency download mode.
Details the 2.4 GHz and 5 GHz dual-band WLAN capabilities.
Lists the Wi-Fi transmitting and receiving performance metrics.
Information on Bluetooth 5.0 specifications and capabilities.
Details the Bluetooth transmitting and receiving performance.
Presents the performance metrics of the integrated GNSS engine.
Provides guidelines for optimal GNSS RF design to ensure performance.
Defines pins for main and diversity antennas, and their impedance.
Lists the operating frequencies for different module variants across various bands.
Shows reference circuit designs for main and Rx-diversity antenna matching.
Defines the Wi-Fi/Bluetooth antenna interface and its frequency specifications.
Defines the GNSS antenna interface and its frequency specifications.
Provides a reference circuit for connecting passive GNSS antennas.
Provides a reference circuit for connecting active GNSS antennas.
Guidelines for routing RF traces on the PCB for optimal performance.
General guidelines for installing antennas for optimal performance.
Specifies the requirements for various antenna types like VSWR and gain.
Recommends specific RF connectors for antenna connections.
Defines the absolute maximum limits for power supply and pin voltages.
Details the power supply voltage and current ratings under various conditions.
Specifies the voltage requirements for digital I/O interfaces.
Defines the recommended operating and storage temperature ranges.
Provides current consumption values for the module in different states.
Details the RF output power levels for various frequency bands and standards.
Lists the RF receiving sensitivity for different frequency bands and modes.
Information on electrostatic discharge characteristics and protection measures.
Provides the physical dimensions of the module in millimeters.
Illustrates the recommended PCB footprint for mounting the module.
Shows top and bottom views of the module for identification.
Specifies storage requirements, shelf life, and floor life for the module.
Guidance on manufacturing processes, including stencil thickness and reflow soldering.
Details carrier tape and plastic reel dimensions for packaging.
Dimensions and specifications for the plastic reel used in packaging.
Illustrates the step-by-step process for packaging the modules.
Lists related documents for further information and technical details.
Provides definitions for abbreviations and terms used throughout the document.
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