Quectel EG25-G - Packaging

LTE Module Series
EG25-G Hardware Design
EG25-G_Hardware_Design 90 / 100
8.3. Packaging
EG25-G is packaged in tap and reel carriers. Each reel is 11.88m long and contains 250pcs modules. The
figure below shows the package details, measured in mm.
30.3
㊣0.15
29.3
㊣0.15
30.3
㊣0.15
32.5
㊣0.15
33.5
㊣0.15
0.35㊣0.05
4.2
㊣0.15
3.1
㊣0.15
32.5㊣0.15
33.5㊣0.15
4.00
㊣0.1
2.00
㊣0.1
1.75
㊣0.1
20.20
㊣0.15
44.00
㊣0.3
44.00
㊣0.1
1.50
㊣
0.1
Max slope
2 to 3°C/sec
Reflow time (D: over 220°C)
40 to 60 sec
Max temperature
240°C ~ 245°C
Cooling down slope
1 to 4°C/sec
Reflow Cycle
Max reflow cycle
1