LTE Module Series
EG25-G Hardware Design
EG25-G_Hardware_Design 86 / 100
7.2. Recommended Footprint
Figure 45: Recommended Footprint (Top View)
1. The keepout area should not be designed.
2. For easy maintenance of the module, please keep about 3mm between the module and other
components in the host PCB.
3. EG25-G share the same recommended footprint with EC25, but different recommended stencil.
Refer to document [4] for more information.
To Next Page
Loading...
