LTE Module Series
EG25-G Hardware Design
EG25-G_Hardware_Design 14 / 100
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands
Two pins including NET_MODE and NET_STATUS to indicate network
connectivity status
Including main antenna interface (ANT_MAIN), Rx-diversity antenna
interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS)
Size: (29.0±0.15)mm × (32.0±0.15)mm × (2.4±0.2)mm
Weight: approx. 4.9g
Operation temperature range: -35°C ~ +75°C
1)
Extended temperature range: -40°C ~ +85°C
2)
Storage temperature range: -40°C ~ +90°C
All hardware components are fully compliant with EU RoHS directive.
1.
1)
Within operation temperature range, the module is 3GPP compliant.
2.
2)
Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like
P
out
might reduce in their value and exceed the specified tolerances. When the temperature returns to
normal operation temperature levels, the module will meet 3GPP specifications again.
3. “*” means under development.
2.3. Functional Diagram
The following figure shows a block diagram of EG25-G and illustrates the major functional parts.
Power management
Baseband
DDR+NAND flash
Radio frequency
Peripheral interfaces