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| Operating Temperature | -40°C to +85°C |
|---|---|
| Receiver Sensitivity | -94dBm |
| Bluetooth Version | Bluetooth 5 |
| Operating Voltage | 1.8V - 3.6V |
| Power Consumption | Low power consumption |
| Supported Profiles | A2DP, AVRCP, HFP |
| Audio Codec | SBC |
| Package | QFN |
| Peripherals | UART, SPI, I2C, ADC, PWM |
Lists key general functionalities and compliance standards of the chip.
Details specific baseband capabilities and clocking features.
Specifies the memory configurations for MCU and DSP.
Covers transmitter power, receiver sensitivity, and RF port characteristics.
Describes the ARM Cortex-M4F processor, FPU, MPU, and debug interface.
Details the Tensilica Hi-Fi-mini DSP core and voice codecs.
Outlines audio codec capabilities, voltage ranges, and SNR.
Specifies support for PDM and I2S digital audio interfaces.
Mentions Bluetooth core specification compliance and integrated balun.
Highlights the integrated Power Management Unit (PMU) design.
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