The RF-BM-2652P2(I) is a multiprotocol 2.4 GHz wireless module with an integrated power amplifier, designed for a wide range of applications. This module, developed by Shenzhen RF-star Technology Co., Ltd., supports various wireless protocols including Thread, ZigBee, Bluetooth® 5.3 Low Energy, IEEE 802.15.4, 6LoWPAN, and proprietary systems, as well as the SimpleLink™ TI 15.4 stack (2.4 GHz).
Function Description
The RF-BM-2652P2(I) module is built around the TI lower-power CC2652P SoC, which integrates a 48 MHz crystal and a 32.768 kHz crystal. It features an in-system programmable Flash, 256 KB ROM, 8 KB of Cache SRAM, and 80 KB of ultra-low leakage SRAM. The ARM® Cortex®-M4F core processor allows for flexible power modes and efficient operation. The module is designed to simplify the development of long-range and low-power applications by integrating an advanced +20 dBm high-power amplifier, enabling robust communication distance and reliability. It also offers optional antenna output modes (PCB, IPEX connector, and half-hole interface) to provide flexibility in module integration and antenna design.
The module's PA (Power Amplifier) output control is managed by DIO28 and DIO29, which switch the RF output between PA and non-PA modes to control the transmission power range. Specifically, for +5 dBm to +20 dBm (PA) power, DIO28 is 0 and DIO29 is 1. For < 5 dBm power, DIO28 is 1 and DIO29 is 0.
Important Technical Specifications
- Chipset: CC2652P
- Supply Power Voltage: 1.8 V ~ 3.8 V (3.3 V recommended)
- Frequency: 2402 MHz ~ 2480 MHz
- Maximum Transmit Power: +20.0 dBm
- Receiving Sensitivity:
- -100 dBm @ 802.15.4 (2.4 GHz)
- -105 dBm @ Bluetooth 125 kbps (LE Coded PHY)
- GPIO: 23
- Flash: 352 KB
- ROM: 256 KB
- SRAM: 88 KB
- Power Consumption:
- RX current: 6.9 mA
- TX current: 7.3 mA @ 0 dBm (0 dBm)
- TX current: 9.6 mA @ 5 dBm (5 dBm)
- TX current: 22 mA @ 10 dBm (10 dBm)
- TX current: 85 mA @ 20 dBm (20 dBm)
- MCU 48 MHz (CoreMark): 3.4 mA (71 μA/MHz)
- Sensor Controller: 30.1 μA @ Low Power-Mode, 2 MHz, running infinite loop
- Active-Mode: 808 μA @ 24 MHz, running infinite loop
- Standby: 0.94 μA
- Shutdown: 150 nA
- Support Protocols: Thread, ZigBee, BLE5.3, IEEE 802.15.4, 6LoWPAN, proprietary systems, SimpleLink™ TI 15.4 stack (2.4 GHz)
- Crystal: 48 MHz, 32.768 kHz
- Package: SMT packaging (1.27-mm half-hole pitch stamp stick)
- Dimension: 30.0 mm x 16.4 mm x 2.2 mm
- Type of Antenna:
- RF-BM-2652P2: PCB antenna
- RF-BM-2652P2I: IPEX connector, ANT pin
- Operating Temperature: -40 °C ~ +85 °C
- Storage Temperature: -40 °C ~ +125 °C
Usage Features
The module's multiprotocol support makes it highly versatile for various IoT and wireless communication applications, including:
- Wireless healthcare applications: For medical devices requiring reliable and low-power wireless connectivity.
- Energy harvesting applications: Suitable for devices powered by ambient energy sources.
- Asset tracking and management: For tracking goods and assets in logistics and industrial settings.
- Electronic Shelf Label (ESL): For dynamic pricing and product information display in retail.
- Wired networking: As a wireless bridge or gateway in wired networks.
- Small business router: For small office/home office (SOHO) networking solutions.
- Portable electronics: Ideal for battery-powered portable devices due to low power consumption.
- Set-top box: For smart home entertainment systems.
- Connected peripherals: For wirelessly connecting various peripheral devices.
- Keyboard and keypads: For wireless input devices.
- Home theater & entertainment: For home automation and entertainment systems.
- Electronic and robotic toys: For smart toys and robotics.
- Wearables: For wearable technology requiring compact and efficient wireless communication.
The module offers flexible antenna options. The RF-BM-2652P2 features a PCB antenna, while the RF-BM-2652P2I includes an IPEX connector and ANT pin for external antenna integration. When using an external antenna, a Π-type matching circuit is reserved, and 50 Ω impedance control is recommended for RF traces. Traces should be as short as possible, using 135° or arc traces, and avoiding vias to change layers. More GND vias should be placed around RF traces.
Maintenance Features
- Power Supply: It is recommended to provide the module with a DC stabilized power supply with a tiny power supply ripple coefficient. Ensure a stable power supply without frequent fluctuations.
- Antenna Installation: The antenna installation structure significantly impacts performance. Ensure the antenna is exposed and preferably vertically upward. If installed inside a case, use a high-quality antenna extension wire to extend the antenna outside. Avoid installing the antenna inside a metal case, as this will greatly reduce transmission distance.
- Environmental Conditions: The module is sensitive to humidity and temperature. Ensure suitable humidity during installation and application. Avoid using the module at excessively high or low temperatures unless specifically designed for such conditions.
- Electrostatic Discharge (ESD) Warnings: The module can be damaged by static discharge. Follow these precautions:
- Do not touch modules with bare hands.
- Place modules in anti-static areas.
- Consider anti-static circuitry in product design, especially when inputting high voltage (HV) or very high frequency (VHF). Static can degrade performance or cause module failure.
- Soldering and Reflow Conditions:
- Heating Method: Conventional Convection or IR/convection.
- Solder Paste: Sn96.5/Ag3.0/Cu0.5.
- Allowable Reflow Soldering Times: 2 times.
- Peak Temperature: 245 °C.
- Troubleshooting:
- Unsatisfactory Transmission Distance:
- Check for incorrect power register settings or high data rates. Higher data rates may reduce distance.
- Ensure the power supply voltage is within recommended values. Lower voltage can reduce power.
- Verify antenna matching and quality. Unmatched or poor-quality antennas can affect communication distance.
- Vulnerable Module:
- Ensure the supply voltage is within recommended values to prevent permanent damage.
- Implement anti-static installation for high-frequency devices.
- Maintain suitable humidity during installation and application for humidity-sensitive components.
- High Bit Error Rate:
- Identify and avoid co-channel signal interferences by moving away from interference sources or modifying frequency/channel.
- Ensure power supply reliability, as an unsatisfactory supply can cause garbled data.
- Use high-quality and appropriately short extension or feeder wires. Poor quality or excessive length can lead to a high bit error rate.
The RF-BM-2652P2(I) module is a robust and flexible solution for developers seeking to integrate advanced wireless communication capabilities into their products, with comprehensive support for various protocols and a focus on power efficiency and reliability.
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