RF-BM-2652P2(I)
www.szrfstar.com V1.1 - May, 2023
Shenzhen RF-star Technology Co., Ltd. Page 5 of 24
Table of Contents
1 Device Overview ............................................................................................................................................................. 2
1.1 Description............................................................................................................................................................ 2
1.2 Key Features ....................................................................................................................................................... 2
1.3 Applications .......................................................................................................................................................... 3
1.4 Functional Block Diagram .............................................................................................................................. 4
1.5 Part Number Conventions .............................................................................................................................. 4
Table of Contents ................................................................................................................................................................ 5
2 Module Configuration and Functions ...................................................................................................................... 7
2.1 Module Parameters ........................................................................................................................................... 7
2.2 Module Pin Diagram ......................................................................................................................................... 8
2.3 Pin Functions ....................................................................................................................................................... 8
3 Specifications ................................................................................................................................................................. 10
3.1 Recommended Operating Conditions ..................................................................................................... 10
3.2 Handling Ratings .............................................................................................................................................. 10
3.3 PA Output Control ............................................................................................................................................ 10
4 Application, Implementation, and Layout............................................................................................................. 11
4.1 Module Photos .................................................................................................................................................. 11
4.2 Recommended PCB Footprint .................................................................................................................... 11
4.3 Schematic Diagram ......................................................................................................................................... 12
4.4 Reference Design ............................................................................................................................................ 13
4.5 Antenna ................................................................................................................................................................ 13
4.5.1 Antenna Design Recommendation .............................................................................................. 13
4.5.2 Antenna Output Mode Modification .............................................................................................. 14
4.5.3 External Antenna Design Recommendation of the Half-Hole ANT Pin .......................... 15
4.5.4 IPEX Connector Specification ........................................................................................................ 16
4.6 Basic Operation of Hardware Design ...................................................................................................... 16
4.7 Trouble Shooting .............................................................................................................................................. 17
4.7.1 Unsatisfactory Transmission Distance ........................................................................................ 17
4.7.2 Vulnerable Module .............................................................................................................................. 18
4.7.3 High Bit Error Rate ............................................................................................................................. 18
4.8 Electrostatics Discharge Warnings ........................................................................................................... 18