Samsung AM280KXVAGH/EU - Page 12

Product Specications
Samsung Electronics 2-5
Changed
part
Changed item
and feature
Basic After changed
Main PCB
Change Main PCB
- Increase MICOM capability
FAN PCB
Applies 600V IPM by LC
resonance buck-converter
Inverter PCB
(Compressor
Control
PCB)
- Increases current due to
high capacity compressor
- Increases capacitor's capacity
- Applies EMI coil on board
(Deletes core in wire)
EMI PCB
- Develops 50A EMI PBA
→Increases coil size and
fuse capacity
- Improves EMI characteristic.
REACTOR
- Increases current due to
high capacity compressor
- Improved wire connection terminal
Refrigerant
cooling
- Increases heat cooling capacity
- Increases pipe size and heat
exchange area
Changes in comparison to basic mode (cont.)
 AM140/160/180/200/220/240/260/280/300KXVSSS
 AAM100/120/180/200MXVAFC
 AM160/180/260/280/300MXVAGC