Sanyo DP32671 - DISASSEMBLY INSTRUCTIONS (CONTINUED); Flat Package IC Installation Steps

INSTALLATION
4. When brid
g
e-solderin
g
between terminals and/or the
solderin
g
amount are not enou
g
h, resolder usin
g
a Thin
-
1. Take care of the
p
olarit
y
of new IC and then install the
ti
p
Solderin
g
Iron.
(
Refer to Fi
g
. 3-8.
)
new IC fittin
g
on the
p
rinted circuit
p
attern. Then solder
each lead on the dia
g
onal
p
ositions of IC tem
p
oraril
y
.
(
Refer to Fi
g
. 3-5.
)
5. Finall
y
, confirm the solderin
g
status on four sides of the
IC usin
g
a ma
g
nif
y
in
g
g
lass.
Confirm that no abnormalit
y
is found on the solderin
g
p
osition and installation
p
osition of the
p
arts around the
IC. If some abnormalit
y
is found, correct b
y
resolderin
g
.
NOTE
When the IC leads are bent durin
g
solderin
g
and/o
r
2. Su
pp
l
y
the solder from the u
pp
er
p
osition of IC leads re
p
airin
g
, do not re
p
air the bendin
g
of leads. If th
e
slidin
g
to the lower
p
osition of the IC leads. bendin
g
of leads are re
p
aired, the
p
attern ma
y
b
e
(
Refer to Fi
g
. 3-6.
)
dama
g
ed. So, alwa
y
s be sure to re
p
lace the IC in thi
s
case.
DISASSEMBLY INSTRUCTIONS
Soldering Iron
Solder temporarily
Solder temporarily
Fig. 3-5
IC
Thin-tip Soldering Iron
Fig. 3-8
B3-2
3. Absorb the solder left on the lead usin
g
the Braide
d
Shield Wire.
(
Refer to Fi
g
. 3-7.
)
NOTE
Do not absorb the solder to excess.
IC
Soldering Iron
Supply soldering
from upper position
to lower position
Solder
Fig. 3-6
Soldering Iron
IC
Braided Shield Wire
Fig. 3-7
B3-2