Sanyo DP32671 - DISASSEMBLY INSTRUCTIONS (CONTINUED); Flat Package IC Removal and Installation

3. REMOVAL AND INSTALLATION OF
3. When IC starts moving back and forth easily after
FLAT PACKAGE IC
desoldering completely, pickup the corner of the IC using
tweezers and remove the IC b
y
movin
g
with the IC
REMOVA
L
desolderin
g
machine.
(
Refer to Fi
g
. 3-3.
)
1. Put Maskin
g
Ta
p
e
(
cotton ta
p
e
)
around the Flat Packa
ge
NOTE
IC to
p
rotect other
p
arts from an
y
dama
g
e.
(
Refer to Fi
g
. 3-1.
)
Some ICs on the PCB are affixed with
g
lue, so be
careful not to break or dama
g
e the foil of each IC
NOTE
leads or solder lands under the IC when removin
g
it.
Maskin
g
is carried out on all the
p
arts located within
10 mm distance from IC leads.
DISASSEMBLY INSTRUCTIONS
Fig. 3-1
Masking Tape
(Cotton Tape)
IC
Blower type IC
desoldering machine
Tweezers
B3-1
2. Heat the IC leads usin
g
a blower t
yp
e IC desolderin
g
machine.
(
Refer to Fi
g
. 3-2.
)
NOTE
Do not rotate or move the IC back and forth , until IC 4. Peel off the Maskin
g
Ta
p
e.
can move back and forth easil
y
after desolderin
g
the
leads com
p
letel
y
. 5. Absorb the solder left on the
p
attern usin
g
the Braided
Shield Wire.
(
Refer to Fi
g
. 3-4.
)
NOTE
Do not move the Braided Shield Wire in the vertical
direction towards the IC
p
attern.
Blower type IC
desoldering machine
IC
Fig. 3-2
IC
Fig. 3-3
Fig. 3-4
IC pattern
Braided Shield Wire
Soldering Iron
B3-1