SICK SIG200

12 Technical data
12.1 General technical data
Mechanical data
1: L+ 2: DI
2
3: 0V 4: C/DI
1
/DO
1
5: NC
1: TX+ 2: RX+ 3: TX– 4: RX–
IO-Link
1
5
3 4
2
2
4
3
1
1: L+ 2: NC 3: 0V 4: NC
1: +VDC 2: –DATA 3: 0V 4: +DATA
CONFIG
POWER
S1 - S4P1 - P2
IO-Link
SIG200-0A10A00 1080579 10-30 VDC OUT <200 mA Assembled in USA LN {YYWW}:
POWER
AUX
C/DI/DO
DI
C/DI/DO
DI
C/DI/DO
DI
C/DI/DO
DI
LINK
ACT2
LINK
ACT1
AUX
POWER
/DO
DI
/DO
DI
/DO
DI
/DO
DI
LINK
ACT2
LINK
ACT1
SIG200
POWER CONFIG
S1
S2
S3
S4
P2
P1
9 (0.35)
38.3 (1.51)
30 (1.28)
57 (2.24)
36 (1.42)
28 (1.1)
198.5 (7.81)
213.9 (8.42)
1
4
3
2
Ethenet
E497722
Figure 22: Dimensional drawing
Housing material Zinc
Enclosure rating per IEC 60529 IP 67 (only when plugged-in and threaded-in)
1
Dimensions (W x H x D) 213.9 x 38.3 x 57 mm
Mounting type Mounting slots front and side
Weight 520g
1
If cables are not plugged in the connector caps supplied with the device must be tightened to 0.35 Nm
Operating conditions
Operating temperature -40 °C ... +55°C
Storage temperature -40 °C ... +75°C
12 TECHNICAL DATA
94
O P E R A T I N G I N S T R U C T I O N | Sensor Integration Gateway - SIG200 8024482.1FJ7 /2022-05-31 | SICK
Subject to change without notice