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Copyright 2005© Siemens AG
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TD_Repair_L2.5_A70_A75_R1.0.pdf Release 1.0
1 Instruction
This Service Repair Documentation is intended to carry out repairs on Siemens repair level
2.5. The described failures shall be repaired in Siemens authorized local workshops only.
All repairs have to be carried out in an ESD protected environment and with ESD protected
equipment/tools. For all activities the international ESD regulations have to be considered.
Assembling/disassembling has to be done according to the latest A70, A75 Level 2 repair
documentation. It has to be ensured that every repaired mobile Phone is checked according
to the latest released General Test Instruction document (both documents are available in the
Technical Support section of the C-market).
Check at least weekly C-market for updates and consider all A70, A75 related Customer
Care Information, and Repair Information who are relevant for A70, A75.
A70 Partnumber on IMEI label: S30880-S2770-#xxx
A75 Partnumber on IMEI label: S30880-S2790-#xxx
, while # may be any letter (A-Z) and xxx may be any number from 100, 101, 102....
Scrap Handling: All Scrap information given in this manual are related to the
SCRAP-Rules and instructions.
Attention: Consider the new "LEAD-FREE" soldering rules (A70 and A75 affected)
(available in the communication market), avoid excessive heat.
If you have any questions regarding the repair procedures or technical questions spare not
hesitate to contact our technical support team in Kamp-Lintfort, Germany:
Tel.: +49 2842 95 4666
Fax: +49 2842 95 4302
e-mail: st-support@klf.siemens.de
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