SIMATIC IFP2200/2400 ITC2200/2400 frameless
A5E48015893-AC, 03/2021
31
Mechanical ambient conditions
The mechanical ambient conditions for the device and the Transceiver Unit are specified in the table below in terms of
sinusoidal vibration.
Vibration according to IEC 60068-2-6
5 Hz ≤ f ≤ 8.4 Hz (3.5 mm)
8.4 Hz ≤ f ≤ 200 Hz (9.8 m/s
2
Mechanical class 3
see table below
Shock pulses within the specified range can be transferred to the display but do not impact the functionality of the device.
The table below provides information on the type and scope of tests for mechanical ambient conditions.
s
Vibration test in accordance with IEC 60068, Part 2-6 (sine)
Vibration duration: Ten frequency cycles per axis in each of
the three mutually vertical axes
Type of vibration: Frequency cycles at a rate of change of 1
5 Hz ≤ f ≤ 8.4 Hz, constant amplitude 3.5 mm
8.4 Hz ≤ f ≤ 200 Hz, constant acceleration 9.8 m/s
2
Shock test in accordance with IEC 60068, Part 2-27
Severity of shock: Peak value 15 g, duration 11 ms
Direction of shock: 3 shocks in ± direction of axis in
each of the three axes vertical to each other
Reducing vibration and shock
If the device is subjected to heavy shocks or vibrations, you must take appropriate measures to reduce acceleration or
amplitude during installation.
Climatic ambient conditions
The following table shows the climatic ambient conditions for operation of the device.
Temperature, vertical mounting:
0 ... 45 °C (landscape format)
0 ... 40 °C (portrait format)
Temperature, inclined mounting
1
0 ... 40 °C (landscape format)
0 ... 35 °C (portrait format)
Transceiver Unit temperature
vertical, interfaces facing downward
10% to 90%, without condensation
Corresponds to an elevation
of -1000 to 2000 m
2
relative humidity < 60%, no condensation at
2
Relative humidity < 60%, no condensation at
1
see section Permitted mounting positions (Page 19)
Note
Internal temperature of the enclosure
When the device is mounted, the internal temperature of the enclosure must not exceed 55
°C.
system components connected to the device, such as the power supply, must also be suited to the respective