SIM Tech SIMCom SIM800 User Manual

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SIM800_Hardware Design_V1.09 59 2016-06-30
7.3. The Moisture Sensitivity Level
The moisture sensitivity level of SIM800 is 3. The module should be mounted within 168 hours after unpacking
in the environmental conditions of temperature <30°C and relative humidity of <60% (RH). It is necessary to
bake the module if the above conditions are not met:
Table 48: Moisture classification level and floor life
Level
Floor Life (out of bag) at factory ambient≤30°C /60% RH or as stated
1
Unlimited at ≤30°C /85% RH
2
1 year
2a
4 weeks
3
168 hours
4
72 hours
5
48 hours
5a
24 hours
6
Mandatory bake before use. After bake, it must be reflowed within the time limit
specified on the label.
NOTES:
1. If the vacuum package is not open for 6 months or longer than the packing date, baking is also
recommended before re-flow soldering.
2. For product handling, storage, processing, IPC / JEDEC J-STD-033 must be followed.
7.4. Baking Requirements
Because of its sensitivity to moisture absorption, SIM800 should be baked sufficiently before re-flow soldering.
Otherwise SIM800 will be at the risk of permanent damage during re-flow soldering. SIM800 should be baked
192 hours at temperature 40°C +5°C /-0°C and <5% RH for low-temperature device containers, or 72 hours at
temperature 80°C ±5 °C for high-temperature device containers. Care should be taken that the plastic tray is not
heat resistant, SIM800 modules should be taken out for baking, and otherwise the tray may be damaged by
high-temperature during baking.
Table 49: Baking requirements
Baking temperature
Moisture
Time
40°C ±5 °C
<5%
192 hours
120°C ±5 °C
<5%
4 hours

SIM Tech SIMCom SIM800 Specifications

General

Frequency Bands	Quad-band 850/900/1800/1900MHz
Compliant to GSM Phase	2/2+
Low Power Consumption (Sleep Mode)	1.0mA
Operating Temperature	-40°C to +85°C
Data Rate	GPRS: Max. 85.6 kbps (downlink), Max. 42.8 kbps (uplink)
GPRS Multi-slot Class	Class 10
GPRS Mobile Station	GPRS mobile station class B
Transmitting Power	Class 4 (2W) @ 850/900MHz, Class 1 (1W) @ 1800/1900MHz
GPRS Data Features	PBCCH support, Coding schemes CS 1, 2, 3, 4
SMS	Text and PDU mode, MO / MT
USSD	Support
Supply Voltage	3.4V - 4.4V
Dimensions	24mm x 24mm x 3mm
Certifications	CE, RoHS

Summary

Introduction

SIM800 Overview

SIM800 Key Features

Lists the main features and specifications of the SIM800 module.

Operating Modes

Details the different operating states of the SIM800 module.

SIM800 Functional Diagram

Illustrates the internal functional blocks of the SIM800 module.

Package Information

Pin Out Diagram

Shows the pin configuration and numbering of the SIM800 module.

Pin Description

Provides detailed descriptions and comments for each pin of the SIM800 module.

Package Dimensions

Specifies the physical dimensions and mechanical outlines of the SIM800 module.

Application Interface

Power Supply

Details the power supply requirements and reference circuits for the SIM800.

Power on/off SIM800

Explains the procedures for powering the SIM800 module on and off.

Power Saving Mode

Describes the power saving modes available for the SIM800 module.

RTC Backup

Outlines the circuits and methods for Real-Time Clock backup.

Serial Port and USB Interface

Covers the serial port and USB connectivity for communication and debugging.

Audio Interfaces

Explains the audio input and output interfaces for the SIM800 module.

SIM Card Interface

Details the SIM card interface, including pin definitions and design considerations.

PCM Interface

Explains the Pulse Code Modulation interface for audio data.

Keypad Interface

Covers the keypad matrix connections supported by the SIM800.

I2C BUS

Describes the Inter-Integrated Circuit bus interface.

General Purpose Input/Output (GPIO)

Explains the usage of General Purpose Input/Output pins.

ADC

Details the Analog-to-Digital Converter functionality.

PWM

Covers the Pulse Width Modulation output capabilities.

Network Status Indication

Explains the NETLIGHT pin for network status indication.

Operating Status Indication

Describes the STATUS pin for module operating status.

KPLED

Details the KPLED pin for keypad backlight control.

RF Synchronization Signal

Explains the RF synchronization signal for transmit bursts.

Antenna Interface

Covers the GSM and Bluetooth antenna interfaces.

PCB Layout

PIN Assignment

Guidelines for understanding pin assignments for PCB design.

Principle of PCB Layout

Key principles for effective PCB layout design for the module.

Antenna

Recommendations for placing and routing antenna components.

Power Supply

Guidelines for PCB layout of power supply lines and ground.

SIM Card Interface

Layout considerations for the SIM card interface.

Audio Interface

Layout advice to avoid noise in audio traces.

Others

General layout recommendations for UART and USB signals.

Recommended PCB Layout

Illustrates a recommended PCB layout for the module.

Electrical, Reliability and Radio Characteristics

Absolute Maximum Ratings

Specifies the absolute limits for module operation.

Recommended Operating Conditions

Lists the recommended operational parameters for the module.

Digital Interface Characteristics

Details the electrical characteristics of digital interface pins.

SIM Card Interface Characteristics

Electrical characteristics specific to the SIM card interface.

SIM_VDD Characteristics

Electrical characteristics for the SIM VDD power supply.

VDD_EXT Characteristics

Electrical characteristics for the VDD_EXT output.

VRTC Characteristics

Electrical characteristics for the VRTC (RTC backup) pin.

Current Consumption (VBAT=4V)

Table showing current consumption under various operating conditions.

Electro-Static Discharge

ESD sensitivity and test results for the module.

Radio Characteristics

Specifies conducted output power for GSM bands.

Module RF Receive Sensitivity

Details the RF receive sensitivity of the module.

Module Operating Frequencies

Lists the operating frequency bands for the module.

Manufacturing

Top and Bottom View of SIM800

Visual representation of the top and bottom of the SIM800 module.

Typical Solder Reflow Profile

Recommended temperature profile for solder reflow processes.

The Moisture Sensitivity Level

Information on moisture sensitivity and floor life of the module.

Baking Requirements

Guidelines for baking the module to prevent moisture damage.

Appendix

Related Documents

Lists relevant documents for further reference.

Terms and Abbreviations

Safety Caution