SnapNrack Topspeed Mounting System - Maintaining the Grounding Bonding When Removing a Module

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Maintaining the Grounding Bonding When
Removing a Module
INSTRUCTION FOR MAINTAINING THE GROUNDING BONDING WHEN REMOVING A
MODULE FOR SERVICING
CAUTION: Module removal may disrupt the bonding path and could introduce the risk of electric shock. Additional
steps may be required to maintain the bonding path. Modules should only be removed by qualifi ed persons in
compliance with the instructions in this manual.
Module removal is not presented as a frequently expected occurrence and will not be required as part of routine
maintenance.
Scenarios that could result in a disruption of the bonding path are described, for example irregularly-shaped arrays,
arrays consisting of individual rows, and any other scenario where module removal could disrupt the bonding path.
In most cases, the removal of a module for servicing will not disturb or break grounding continuity. If a module is
to be removed that will break continuity, these are the steps that must be taken to maintain a continuously bonded
SnapNrack TopSpeed
TM
System.
Required Tools
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Socket Wrench
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Torque Wrench
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1/2” Socket
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7/16” Socket
Required Materials
#10 Or Larger Bare Copper Conductor
SnapNrack Ground Lug part no. 242-92202
Ilsco Part No. SGB-4
DnoRaxx Dynobond™
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