Component Replacement (elect)
1246-2438 Rev 1
Sony Ericsson Mobile Communications AB – Company Internal
1 Replaceable Components
EXPLANATION OF ABBREVIATIONS USED IN THE COLUMN ‘COMMENTS’ BELOW
COMPONENT LOCATION
P = Primary side
S = Secondary side
MOISTURE SENSITIVITY LEVEL
MSLX (X = 1, 2, 2A, 3, 4, 5, 5A or 6)
For more information on moisture sensitivity levels:
Refer to 1220-1336: Generic Repair Manual – electrical, section ‘Moisture & Baking’!
REPAIR METHOD
HA = Hot Air (removal & mounting)
ST = Soldering Tool (removal & mounting)
HA/ST = Hot Air for removal - Soldering Tool for mounting
BGA = BGA Station
BH = Bottom Heater
ADDITIONAL INFORMATION
1 (2,3,4, etc.) = Proceed to ‘Additional Repair Info’ for further instructions in the indicated section(s).
CALIBRATION
C = Calibration of the phone is required after replacing the component
Calibration to be done by authorized centers only!
To Next Page
Loading...
