— 2 —
MODEL IDENTIFICATION
— BACK PANEL —
TABLE OF CONTENTS
1. SERVICING NOTE ........................................................... 3
2. GENERAL ....................................................................4
3. DISASSEMBLY
3-1. Front Panel Assembly ......................................................... 9
3-2. Back Panel Assembly ......................................................... 9
3-3. Table Assembly ................................................................ 10
3-4. Mechanism Deck Assembly ............................................. 10
3-5. Base Unit Assembly ......................................................... 11
4. TEST MODE............................................................... 12
5. ADJUSTMENTS
5-1. Mechanical Adjsument ..................................................... 13
5-2. Electrical Block Checking ................................................ 19
6. DIAGRAMS
6-1. Circuit Boards Location ................................................... 21
6-2. IC Pin Function
• IC101 Digital Servo, Digital Signal Processor
(CXD2545Q) ................................................................ 22
• IC303 System Control (CXP84332-Q28Q) ................. 25
6-3. Block Diagram ................................................................. 27
6-4. Printed Wiring Board — BD, DISP Section — ............... 31
6-5. Schematic Diagram — BD, DISP Section — .................. 35
6-6. Printed Wiring Board — MAIN Section — ..................... 39
6-7. Schematic Diagram — MAIN Section —........................ 43
6-8. IC Block Diagrams ........................................................... 47
7. EXPLODED VIEWS
7-1. Case and Back Panel Section ........................................... 50
7-2. Disc Table Section ............................................................ 51
7-3. Front Panel Section .......................................................... 52
7-4. Mechanism Section-1 (CDM-40) ..................................... 53
7-5. Mechanism Section-2 (CDM-40) ..................................... 54
7-6. Base Unit Section-1 (KSM-213BKN/M-N) ..................... 55
7-7. Base Unit Section-2 (KSM-213BKN/M-N) ..................... 56
8. ELECTRICAL PARTS LIST ........................................ 57
US Model : 0π
Canadian Model : 1π
AEP,German Model : 2π
UK Model : 3π
E,PX Model : 4π
Singapore Model : 5π
Austrarian Model : 6π
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
The laser component in this product
is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
This caution label
is located inside
the unit.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
4-982-790-
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