Sony HCD-CP505 - Diagrams Section Notes

44
HCD-CP505
SECTION 6
DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
• 5 : fusible resistor.
• C : panel designation.
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
a
: Through hole.
• : Pattern from the side which enables seeing.
• A : B+ Line.
• B : B– Line.
• H : adjustment for repair.
•Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
BD (CD) board
no mark : CD stop
BD (MD) board
no mark : MD stop
( ) : MD playback
TC board
no mark : FM
( ) : TAPE record
Other boards
no mark : FM
< > : CD stop
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• Indication of transistor
Caution:
Pattern face side: Parts on the pattern face side seen from
(SIDE B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
•Abbreviation
CH : Chinese model
HK : Hong Kong model
• Signal path.
F : FM
J : CD
I : CD DIGITAL IN (OPTICAL)
E : PB (TAPE)
a : REC (TAPE)
p : PB (MD)
l : REC (MD)
B
These are omitted.
CE
B
These are omitted.
CE
C
B
These are omitted.
E
Q