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General| Type | Mini Hi-Fi Component System |
|---|---|
| CD Player | Yes |
| Supported Disc Types | CD, CD-R, CD-RW |
| Frequency Response | 20Hz - 20kHz |
| Signal-to-Noise Ratio | 90 dB |
Details power output and impedance for front, center, and rear speakers.
Input/output, performance, and tuning range details for video, CD, tape, and tuner.
Guidelines for replacing chip components, especially tantalum capacitors.
Advice on repairing flexible circuit boards, including soldering iron temperature.
Precautions for handling the optical pick-up block due to electrostatic discharge.
Guidelines for checking laser diode emission safely from a distance.
Procedure for checking laser diode and focus search using the 'S curve'.
Instructions for disassembling the front panel and sub panel assemblies.
Steps for removing the main board and tape/CD mechanism decks.
Steps for disassembling the base unit and installing the disc table.
Procedures for resetting the unit and preparing for shipping.
Allows free running of the CD sled motor for tasks like cleaning.
Allows changing the AM channel step between 9kHz and 10kHz.
Activates all LEDs and the fluorescent tube for key check and display verification.
Displays and switches through mechanical error history.
Displays and switches through NO DISC error history.
Measurement of torque for tape deck components like capstan and pinch rollers.
Adjustments for record/playback head azimuth and playback levels on both decks.
Procedure for adjusting tape speed for Deck A using test modes.
Procedures for adjusting record bias and record level for Deck B.
Performing and checking the S-curve waveform for CD focus and tracking.
Checking E-F balance and RF signal level using waveforms.
Diagram showing the physical location of various circuit boards within the unit.
Schematics and PWBs for CD, Deck, and Main sections.
Schematics and PWBs for both DR7AV and XB800AV power sections.
Diagrams for Panel FL, VR, TC, Jack, Leaf SW, Trans, Surround sections.
Block diagrams for key ICs used in the unit.
Exploded views for external case, chassis, and base unit assemblies.
Exploded views for front panel components in two sections.
Exploded views for TC mechanism, CD mechanism, and Base unit parts.
