HT-NT5
8
BOND FIXED POSITION OF ELECTRICAL PARTS
When the parts that fi xed on the board by the bond have been removed, fi x the parts by using the bond in the mounting to the board.
(Refer to the fi gure below)
– POWER Board
(Component Side) –
– AMP Board (Side A) –
LF901
C902 or C989
C903 or C990
C914 or C915
R914
C907 or C988
TH901
VDR901
C905
C976
C977
C967
F931 C969
C941
C935 or C938
C970
C6183 C6153 C6082 C6057
MALFUNCTION PREVENTION OF THE BUTTON (TOUCH
PANEL SWITCH)
When the button portion on the top side of the main unit are
touched with something such as the fl oor surface, there is a pos-
sibility of occurring the malfunction.
When performing the operation check in the state that the top side
on this unit is under, set the stand etc. to the position that avoids the
button portion as shown in the fi gure below, perform in the state
that the button portion does not touch anything.
bottom side
stand
stand
button portion
SPREADING OF COMPOUND
When the IC6004 and IC6007 on the AMP board or the AMP board
is replaced, spread the compound to the touching portion between
the IC6004, IC6007 and the heat sink.
IC6004 IC6007
– AMP Board (Side A) –
compound compound
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