Sony TC-WE435 Service Manual

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Model Name Using Similar Mechanism TC-WE425/WE525/WR681
DECK A TCM-230ASR3/HSR3
DECK B TCM-230ASR4/HSR4
SERVICE MANUAL
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Chinese Model
STEREO CASSETTE DECK
SPECIFICATIONS
Dolby noise reduction extension manufactured under license
from Dolby Laboratories Licensing Corporation.
HX Pro originated by Bang & Olufsen. “DOLBY”, the double-D
symbol a and “HX PRO” are trademarks of Dolby Laboratories
Licensing Corporation.
TC-WE435
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Transport Mechanism Type
Ver 1.1 2001. 05
9-928-829-12
2001E0200-1
© 2001.5
Sony Corporation
Personal Audio Company
Shinagawa Tec Service Manual Production Group
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T E L 1 3 9 4 2 2 9 6 5 1 3 9 9 2 8 9 4 2 9 8 0 5 1 5 1 3 6 7 3
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TEL 13942296513 QQ 376315150 892498299 TEL 13942296513 QQ 376315150 892498299
http://www.xiaoyu163.com
http://www.xiaoyu163.com

Sony TC-WE435 Specifications

General

Track System	4-track, 2-channel stereo
Tape Speed	4.8 cm/s
Motor	DC Servo Motor
Power Supply	AC 120V, 60Hz
Type	Double Cassette Deck
Frequency Response (Chrome Tape)	30 Hz - 16 kHz
Frequency Response (Metal Tape)	30 Hz - 17 kHz
Inputs	Line In
Outputs	Line Out, Headphones
Dimensions	430 x 125 x 290 mm

Summary

Safety Check-out

LEAKAGE

Procedure for measuring AC leakage current from metal parts.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK ▲ OR DOTTED LINE...

Identifies components critical for safe operation and requires replacement with specified parts.

SECTION 1 GENERAL

LOCATION OF PARTS AND CONTROLS

Diagram and list of front panel controls and their functions.

SECTION 2 DISASSEMBLY

2-1. CASE

Procedure for removing the outer case of the unit.

2-2. FRONT PANEL ASSEMBLY

Steps for disassembling the front panel assembly.

2-3. CASSETTE LID ASSEMBLY (DECK A/B)

Procedure for disassembling the cassette lid for both decks.

2-4. MECHANISM DECK ASSEMBLY (DECK A/B)

Steps for removing the mechanism deck assembly.

2-5. LEAF SW (PB) BOARD (DECK A), LEAF SW (REC/PB) BOARD (DECK B)

Disassembly of leaf switch boards for both decks.

2-6. PINCH LEVER (FWD)/(REV) ASSEMBLY (DECK A/B)

Procedure for disassembling pinch lever assemblies.

2-7. FLYWHEEL (FWD)/(REV) ASSEMBLY (DECK A/B)

Steps for disassembling flywheel assemblies.

2-8. MECHANICAL BLOCK ASSEMBLY (DECK A/B)

Disassembly of the main mechanical block.

2-9. HEAD RELAY (PB) BOARD (DECK A), HEAD RELAY (REC/PB) BOARD (DECK B)

Disassembly of head relay boards for both decks.

SECTION 3 SERVICE MODE

KEY CHECK & DISPLAY CHECK MODE

Instructions for entering and operating service mode for key and display checks.

SECTION 4 MECHANICAL ADJUSTMENTS

Torque Measurement

Procedure for measuring torque on various parts like pinch rollers and belts.

SECTION 5 ELECTRICAL ADJUSTMENTS

Test Mode

Procedure for activating test mode for playback speed and counter functions.

Record/Playback Head Azimuth Adjustment

Procedure for adjusting head azimuth for optimal playback.

Tape speed Adjustment

Procedure for adjusting tape speed using a frequency counter.

Playback Level Adjustment

Procedure for adjusting playback signal levels.

Bias Consumption Current Adjustment

Adjusting bias consumption current when replacing head or bias transformer.

Record Level Adjustment

Procedure for setting record input and output signal levels.

Record Bias Adjustment

Procedure for adjusting record bias levels.

SECTION 6 DIAGRAMS

6-1. CIRCUIT BOARDS LOCATION

Diagram showing the location of various circuit boards within the unit.

6-2. PRINTED WIRING BOARD - MAIN SECTION -

Printed wiring board layout for the main section.

6-3. SCHEMATIC DIAGRAM – MAIN (1/4) SECTION –

Schematic diagram of the main section, part 1 of 4.

6-17. IC PIN FUNCTION

Pin functions for IC801 SYSTEM CONTROL.

SECTION 7 EXPLODED VIEWS

7-1. CASE SECTION

Exploded view and parts list for the unit's case.

7-5. TAPE MECHANISM SECTION

Exploded view and parts list for the tape mechanism components.

SECTION 8 ELECTRICAL PARTS LIST

RESISTORS

List of resistors with part numbers, values, and specifications.

SEMICONDUCTORS

List of diodes, transistors, and ICs with part numbers.

CAPACITORS

List of capacitors with part numbers, values, and specifications.

REVISION HISTORY

Version 1.1 (2001.05)

Silver model added.

Version 1.0 (1999.03)

New.