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Sony TCM-16 - General Information

Sony TCM-16
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— 2 —
Notes on chip component replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
Keep the temperature of soldering iron around 270˚C
during repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering
or unsoldering.
TABLE OF CONTENTS
1. GENERAL ·········································································· 2
2. DISASSEMBLY
2-1. Lid Sub Assy, Cassette ···················································· 3
2-2. Main Board, Mechanism Deck ······································· 3
2-3. Belt ·················································································· 4
2-4. Head, Magnetic, Pinch Roller ····································· 4
3. MECHANICAL ADJUSTMENT ·································· 5
4. ELECTRICAL ADJUSTMENT ···································· 5
5. DIAGRAMS
5-1. IC Block Diagram ··························································· 6
5-2. Block Diagram ································································ 7
5-3. Schematic Diagram ························································· 9
5-4. Printed Wiring Board ···················································· 11
6. EXPLODED VIEWS
6-1. Cabinet Section ····························································· 13
6-2. Mechanism Deck Section-1 (MT-323-118) ·················· 14
6-3. Mechanism Deck Section-2 (MT-323-118) ·················· 15
7. ELECTRICAL PARTS LIST ······································· 16
SECTION 1
GENERAL
This section is extracted
from instruction manual.
VOL
M FF/CUE
x STOP
m REW/REVIEW
PAUSE .
N PLAY
EAR
z REC
x STOP
m REW/
REVIEW
PAUSE .
Built-in mic
Micrófono incorporado
Microfone incorporado
BATT

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