Supermicro X12SPW-TF - Processor and Heatsink Installation Procedures

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Chapter 2: Installation
2.2 Processor and Heatsink Installation
The processor (CPU) and processor carrier should be assembled together rst to form
the processor carrier assembly. This will be attached to the heatsink to form the processor
heatsink module (PHM) before being installed onto the CPU socket.
Notes:
• Use ESD protection.
• Shut down the system and then unplug the AC power cord from all power supplies.
• Check that the plastic protective cover is on the CPU socket and none of the socket pins
are bent. If they are, contact your retailer.
• When handling the processor, avoid touching or placing direct pressure on the LGA lands
(gold contacts). Improper installation or socket misalignment can cause serious damage
to the processor or CPU socket, which may require manufacturer repairs.
• Thermal grease is pre-applied on new heatsinks. No additional thermal grease is needed.
• Refer to the Supermicro website for updates on processor support.
• All graphics in this manual are for illustration purposes only. Your components may look
di󰀨erent.
The 3rd generation Intel Xeon Scalable Processor Series
3rd Generation Intel Xeon Scalable Processor