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Supermicro X12SPW-TF - Assembling the Processor Heatsink Module

Supermicro X12SPW-TF
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27
Chapter 2: Installation
Assembling the Processor
Heatsink Module
After creating the processor carrier
assembly for the 3rd Generation Intel
Xeon Scalable processor, mount it onto
the heatsink to create the processor
heatsink module (PHM):
1. Note the label on top of the
heatsink, which marks the heatsink
mounting holes as 1, 2, 3, and 4. If
this is a new heatsink, the thermal
grease has been pre-applied on
the underside. Otherwise, apply the
proper amount of thermal grease.
2. Turn the heatsink over with the
thermal grease facing up. Hold
the processor carrier assembly so
the processor's gold contacts are
facing up, then align the triangle
on the assembly with hole 1 of
the heatsink. Press the processor
carrier assembly down. The plastic
clips of the assembly will lock
outside of holes 1 and 2, while the
remaining clips will snap into their
corresponding holes.
3. Examine all corners to ensure that
the plastic clips on the processor
carrier assembly are rmly attached
to the heatsink.
1
2
Processor Carrier Assembly
(Upside Down)
Heatsink
(Upside Down)
Check each corner to ensure
that the processor carrier is rmly
attached to the heatsink

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