Technics SU-V4A E - Page 5

e How to remove the front panel and the bottom board
1. Remove the 4 setscrews (Fig. 3 : (0 ~(3) holding the front panel.
2. Pull the front panel outward from the front of the unit. (Fig. 3:@)
3. To remove the bottom board, remove the 7 setscrews (Fig. 4: ~ 0) holding the bottom board.
e
How
to
remove
the
power
IC
1.
Remove
the
cabinet
and
bottom
board.
(Refer
to
the
sections
‘‘How
to
remove
the
cabinet”’
and
‘’How
to
remove
the
front
panel
and
the
bottom
board”)
2. Unsolder of power IC for both L ch and R ch.
3.
Remove
the
4
setscrews
(Fig.
5:
@D
~@))
at
the
bottom
of
the
heat
sink
and
then
remove
the
heat
sink
along
with
the
power
IC
in
the
direction
of
the
arrow
@
.
(Refer
to
Fig.
6)
4. Remove the 2 setscrews (Fig. 6 :
@), @6)) used to secure the power
IC on the heat sink and then pull
the power IC,
9. When mounting the power IC,
Rear panel
apply
silicone
compound
(or
_a)
©
equivalent
heat
diffuser)
to
the
@5)
rear
side
of
power
IC,
and
then
eae
follow
the
steps
1—~
4
reversely.
Heat sink
Power IC Power IC
bracket
[Fig. 6]
@
ADJUSTING
INSTRUCTIONS
es:
ENGL|SH
see
®
Setting
of
controls
and
instruments
to
be
used
1.
Speaker
switch
.......
main
3.
DC
voltmeter
(capable
to
measure
5mV)
2.
Volume.......
Cnn
0
(minimum)
1.
Adjustment
of
Clamp
Voltage
and
Ice
| No.| Adjustment | DC Voltmeter Connections Adjusting Point
L channel
Between and Giese
(minus probe)
R channe!
Between Bessieva and Beacon’
(minus probe)
Adjustment Procedure
* Turn Icasemi-fixed resistors
R367, 368 to minimum. {counter-
clockwise direction)
* Adjust R337 (L ch) and R338
(R ch) to approx.
0.5mV after ten minutes warm-up
time.
R337 (L channel)
Clamp Voltage
R338 (R channel)
L channel
Between and
(minus probe)
R channel
Between and (igs
(minus probe)
R367 (L channel) | * Adjust R367 (L ch) and R368
(R ch) to approx.
15.5mV_ after ten minutes
warm-up time.
ica
(Adjustment using
a DC voltmeter)
R368 {R channel)