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SPRUIM4B–December 2018–Revised May 2020
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xWR1843 Evaluation Module (xWR1843BOOST) Single-Chip mmWave
Sensing Solution
2.6 Connecting the BoosterPack to the LaunchPad or the MMWAVE-DEVPACK
The development pack may be required with the BoosterPack for the following use cases:
• Connecting to Radar Studio
Radar Studio TSW1400+Devpack, mmwave Studio TSW1400+Devpack/DCA1000 tool is a tool that
provides capability to configure the mmWave front end from the PC. This tool is available in the DFP
package and refers to single dfp landing page for both pieces of software.
• Capturing high-speed LVDS data using the SW1400, TSW1400 or DCA1000 FPGA platform from TI
(see High Speed Data Capture and Pattern Generation Platform).
The TSW1400 FPGA platform allows users to capture the raw ADC data over the high-speed debug
interface and post process it in the PC.
• Getting DSP trace data through the MIPI 60-pin interface
• Use the DMM interface
This BoosterPack can be stacked on top of the Launchpad or the MMWAVE-DEVPACK by using the two
20-pin connectors. The connectors do not have a key to prevent the misalignment of the pins or reverse
connection. Hence, care must be taken to ensure reverse mounting does not take place.
On the xWR1843 BoosterPack, TI has provided 3V3 markings near pin 1, shown in Figure 9. The same
marking is provided on compatible LaunchPads (must be aligned before powering up the boards).
Figure 9. 3V3 and 5V Marking on BoosterPack
For details on these use cases, see the MMWAVE-DEVPACK User 's Guide.
NOTE: The DCA1000 EVM has internal DEVPACK functionality. For more information, see the
DCA1000EVM Data Capture Card User's Guide.
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