u-blox SAM-M8Q - Contents; Table of Contents

SAM-M8Q - Hardware Integration Manual
UBX-16018358 - R05 Production Information Contents
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Contents
Preface ................................................................................................................................ 3
Contents .............................................................................................................................. 4
1 Hardware description .................................................................................................. 5
1.1 Overview ................................................................................................................................................................................. 5
1.2 Configuration .......................................................................................................................................................................... 5
1.3 Connecting power ................................................................................................................................................................... 5
1.4 Interfaces ................................................................................................................................................................................. 6
1.4.1 UART .................................................................................................................................................................................. 6
1.4.2 Display Data Channel (DDC) ................................................................................................................................................. 6
1.5 I/O pins .................................................................................................................................................................................... 7
1.5.1 RESET_N: Reset .................................................................................................................................................................... 7
1.5.2 EXTINT: External interrupt .................................................................................................................................................... 7
1.5.3 TIMEPULSE .......................................................................................................................................................................... 7
1.5.4 SAFEBOOT_N ...................................................................................................................................................................... 7
1.6 Electromagnetic interference on I/O lines ................................................................................................................................... 8
2 Design ........................................................................................................................... 9
2.1 Pin description ......................................................................................................................................................................... 9
2.2 Minimal design ........................................................................................................................................................................ 9
2.3 Footprint and paste mask ....................................................................................................................................................... 10
2.4 Antenna ................................................................................................................................................................................ 11
2.5 Embedded antenna operation................................................................................................................................................. 12
2.6 PCB layout suggestion ............................................................................................................................................................ 13
3 Product handling ........................................................................................................ 14
3.1 Packaging, shipping, storage and moisture preconditioning ..................................................................................................... 14
3.2 Soldering ............................................................................................................................................................................... 14
3.3 EOS/ESD/EMI precautions ....................................................................................................................................................... 17
3.3.1 Electromagnetic interference (EMI) ..................................................................................................................................... 18
3.4 Applications with cellular modules .......................................................................................................................................... 19
Appendix .......................................................................................................................... 21
A Glossary ...................................................................................................................... 21
B Recommended parts .................................................................................................. 21
Related documents........................................................................................................... 22
Revision history ................................................................................................................ 22
Contact .............................................................................................................................. 23