ZED-F9P-Integration manual
These are recommendations only and not specifications. The exact copper, solder and paste
mask geometries, distances, stencil thickness and solder paste volumes must be adapted
to the specific production processes (e.g. soldering etc.) of the customer.
Refer to the ZED-F9P Data sheet [1] for the mechanical dimensions.
4.7.2.1 Footprint
Figure 44: ZED-F9P suggested footprint (i.e. copper mask)
UBX-18010802 - R08
4 Design Page 83 of 110
Early production information
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